公开(公告)号：US20220384686A1

公开(公告)日：2022-12-01

申请号：US17782316

申请日：2019-12-31

Applicant: LG ELECTRONICS INC.

Inventor： Eunjeong KANG ,  Byungjoon RHEE

IPC: H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  G09F9/30 ,  H01L33/00

Abstract: Discussed is a display device using a light emitting device includes a plurality of anode electrodes, a plurality of cathode electrodes positioned on one side of the anode electrodes, and a plurality of light emitting device assemblies electrically connected to the anode and cathode electrodes to configure individual sub-pixels. The light emitting device assembly includes a light emitting device, a first electrode disposed on the light emitting device and electrically connected to the anode electrode through conductive balls, a second electrode disposed on the light emitting device and electrically connected to the cathode electrode by conductive balls, first adhesive layers disposed on the first electrode and the second electrode to be spaced apart from each other, and a second non-conductive adhesive layer positioned on the first adhesive layers.

公开(公告)号：US20230282792A1

公开(公告)日：2023-09-07

申请号：US18019320

申请日：2020-08-18

Applicant: LG ELECTRONICS INC.

Inventor： Eunjeong KANG ,  Byungjoon RHEE

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/34

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L23/345

Abstract: According to an embodiment, a thermocompression device for thermally compressing a semiconductor light emitting element array onto a wiring board may comprise: a lower head that supports the wiring board; an upper head that moves a donor including the semiconductor light emitting element array, and presses the semiconductor light emitting element array against a first region of the wiring board; a heating unit that heats at least one among the lower head and the upper head; a suction groove provided along an edge of the first region on the upper surface of the lower head; and a suctioning unit that communicates with the suction groove to suction the wiring board.

公开(公告)号：US20220190220A1

公开(公告)日：2022-06-16

申请号：US17254683

申请日：2020-02-20

Applicant: LG ELECTRONICS INC.

Inventor： Eunjeong KANG ,  Byungjoon RHEE

IPC: H01L33/62 ,  H01L33/38

Abstract: The present invention includes a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, and an anisotropic conduction comprising a mixture of conductive particles and an insulating material disposed between the semiconductor light emitting devices and a light transmitting layer formed between the semiconductor light emitting devices. The anisotropic conductive layer is also formed between the wiring electrodes, and the light transmitting layer is formed on the anisotropic conductive layer formed between the wiring electrodes.