公开(公告)号：US20230411575A1

公开(公告)日：2023-12-21

申请号：US18036358

申请日：2020-11-10

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae WI ,  Byungjoon RHEE ,  Hwanjoon CHOI

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L33/38

Abstract: Disclosed are a display device using a semiconductor light emitting element, and a method for manufacturing same. In order to achieve the above objective, the display device according to an embodiment of the present disclosure may comprise: a wiring substrate; wiring electrodes at least partially placed on the wiring substrate; light emitting elements each electrically connected to a wiring electrode corresponding thereto, among the wiring electrodes; adhesive patterns having an adhesive property for bonding the wiring electrodes and the light emitting elements and a transfer property required for transferring the light emitting elements to the wiring electrodes, wherein each of the adhesive patterns may be formed for at least one combined pair formed by a wiring electrode and a light emitting element electrically connected to each other, among the wiring electrodes and the light emitting elements, and the adhesive patterns are formed to be spaced apart from each other.

公开(公告)号：US20230282792A1

公开(公告)日：2023-09-07

申请号：US18019320

申请日：2020-08-18

Applicant: LG ELECTRONICS INC.

Inventor： Eunjeong KANG ,  Byungjoon RHEE

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/34

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L23/345

Abstract: According to an embodiment, a thermocompression device for thermally compressing a semiconductor light emitting element array onto a wiring board may comprise: a lower head that supports the wiring board; an upper head that moves a donor including the semiconductor light emitting element array, and presses the semiconductor light emitting element array against a first region of the wiring board; a heating unit that heats at least one among the lower head and the upper head; a suction groove provided along an edge of the first region on the upper surface of the lower head; and a suctioning unit that communicates with the suction groove to suction the wiring board.

公开(公告)号：US20220278254A1

公开(公告)日：2022-09-01

申请号：US17631781

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon RHEE

IPC: H01L33/38 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/62

Abstract: The present invention provides a display device using a semiconductor light-emitting element and a manufacturing method therefor, the display device transferring semiconductor light-emitting elements on a temporary substrate, and then directly implementing, through a stack process, the structure of a wiring substrate on the temporary substrate on which the semiconductor light-emitting elements are arrayed, thereby enabling the semiconductor light-emitting elements and the wiring substrate to be electrically connected.

公开(公告)号：US20220190220A1

公开(公告)日：2022-06-16

申请号：US17254683

申请日：2020-02-20

Applicant: LG ELECTRONICS INC.

Inventor： Eunjeong KANG ,  Byungjoon RHEE

IPC: H01L33/62 ,  H01L33/38

Abstract: The present invention includes a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, and an anisotropic conduction comprising a mixture of conductive particles and an insulating material disposed between the semiconductor light emitting devices and a light transmitting layer formed between the semiconductor light emitting devices. The anisotropic conductive layer is also formed between the wiring electrodes, and the light transmitting layer is formed on the anisotropic conductive layer formed between the wiring electrodes.

公开(公告)号：US20220123175A1

公开(公告)日：2022-04-21

申请号：US17257686

申请日：2018-09-27

Applicant: LG ELECTRONICS INC.

Inventor： Kyoungtae WI ,  Byungjoon RHEE

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/12 ,  H01L25/075

Abstract: Discussed is a display device, including a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light-emitting elements electrically connected to the wiring electrode, an anisotropic conductive layer disposed between the plurality of semiconductor light-emitting elements and formed of a mixture of conductive particles and an insulating material; and a buffer portion disposed on a lower surface of a semiconductor light-emitting element of the plurality of semiconductor light-emitting elements so as to allow the wiring electrode and the semiconductor light-emitting element to be spaced apart by a predetermined distance, and provided with at least one hole, wherein the mixture of the conductive particles and the insulating material is disposed inside the at least one hole, and the wiring electrode is electrically connected to the semiconductor light-emitting element through conductive particles disposed inside the at least one hole.

公开(公告)号：US20200343426A1

公开(公告)日：2020-10-29

申请号：US16962325

申请日：2018-02-01

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon RHEE

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48

Abstract: Discussed is a display apparatus and, more particularly, to a display apparatus using a semiconductor light emitting device. A display apparatus includes a substrate having a first wiring; a rib portion provided with a first rib and a second rib formed to protrude from one surface of the substrate, the first and second ribs disposed on opposite sides of the first wiring; a solderable metal filled between the first rib and the second rib, and formed to cover the first wiring; and a plurality of semiconductor light emitting devices sequentially arranged along the rib portion, at least part of the plurality of semiconductor light emitting devices are inserted into the solderable metal to be electrically connected to the first wiring

公开(公告)号：US20160240517A1

公开(公告)日：2016-08-18

申请号：US14794305

申请日：2015-07-08

Applicant: LG ELECTRONICS INC.

Inventor： Chisun KIM ,  Byungjoon RHEE ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/0753 ,  G09F9/33 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/95 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A display device including a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices. Further, the conductive adhesive layer includes a body provided with a resin having an adhesive property; and a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound and aggregated with each other.

Abstract translation: 一种显示装置，包括具有布线电极的布线基板; 多个形成像素的半导体发光器件; 以及导电性粘合剂层，其被配置为将所述布线电极与所述多个半导体发光器件电连接。 此外，导电性粘合剂层包括具有粘合性的树脂的本体; 金属凝集体，其设置在体内，形成为从金属有机化合物析出的金属原子，并且彼此聚集。

公开(公告)号：US20150171297A1

公开(公告)日：2015-06-18

申请号：US14478599

申请日：2014-09-05

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon RHEE ,  Kyuhyun BANG

IPC: H01L33/62 ,  H01L33/50 ,  F21K99/00

CPC classification number: F21K9/50 ,  F21K9/60 ,  F21Y2115/10 ,  H01L33/38 ,  H01L33/387 ,  H01L2224/95 ,  H05K1/113 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106

Abstract: Discussed is a display device including a wiring substrate disposed with a first electrode; a conductive adhesive layer disposed between the wiring substrate and a second electrode; and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices comprises a first conductive electrode and a second conductive electrode disposed to be separated from each other, the at least one of the semiconductor light emitting devices having a lateral surface, and wherein the second conductive electrode extends beyond the lateral surface of the at least one of semiconductor light emitting devices.

Abstract translation: 讨论了包括布置有第一电极的布线基板的显示装置; 布置在所述布线基板和第二电极之间的导电粘合剂层; 以及耦合到所述导电粘合剂层并且电连接到所述第一电极和所述第二电极的多个半导体发光器件，其中所述多个半导体发光器件中的至少一个包括第一导电电极和设置的第二导电电极 所述至少一个所述半导体发光器件具有侧表面，并且其中所述第二导电电极延伸超过所述至少一个半导体发光器件的侧表面。

公开(公告)号：US20150115296A1

公开(公告)日：2015-04-30

申请号：US14506294

申请日：2014-10-03

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon RHEE ,  Chisun KIM ,  Eunhye KIM ,  Kyuhyun BANG

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L2224/14 ,  H05K1/111 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/051 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: Discussed is a display device including a wiring substrate having a first substrate layer and a second substrate layer, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to a first electrode and a second electrode, wherein the first electrode is disposed at the first substrate layer, and the second substrate layer includes one surface facing the conductive adhesive layer and the other surface covering the first electrode, and an auxiliary electrode electrically connected to the first electrode and the second electrode are disposed on one surface of the second substrate layer.

Abstract translation: 讨论了包括具有第一基板层和第二基板层的布线基板的显示装置，配置为覆盖布线基板的导电性粘合层，以及与导电性粘合剂层连接的多个半导体发光元件， 第一电极和第二电极，其中第一电极设置在第一衬底层处，并且第二衬底层包括面向导电粘合剂层的一个表面和覆盖第一电极的另一表面，以及辅助电极，电连接到 第一电极和第二电极设置在第二基板层的一个表面上。

公开(公告)号：US20230178686A1

公开(公告)日：2023-06-08

申请号：US17925152

申请日：2020-05-14

Applicant: LG ELECTRONICS INC.

Inventor： Hwanjoon CHOI ,  Byungjoon RHEE ,  Kyuhyun BANG ,  Kyoungtae WI

IPC: H01L33/22 ,  H01L33/38 ,  H01L33/00

CPC classification number: H01L33/22 ,  H01L33/0008 ,  H01L33/38 ,  H01L27/15

Abstract: Discussed is a semiconductor light emitting device that can include a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer, a first pad electrode electrically connected to the first conductivity type semiconductor layer, a second pad electrode electrically connected to the second conductivity type semiconductor layer, a first pattern structure disposed on the first pad electrode, and a second pattern structure disposed on the second pad electrode, wherein the first pattern structure comprises a first metal pattern structure disposed on the first pad electrode, a first adhesive material disposed on the first metal pattern structure, and a first conductive particle disposed in the first metal pattern structure.