公开(公告)号：US20240120218A1

公开(公告)日：2024-04-11

申请号：US18275548

申请日：2021-02-03

Applicant: LG ELECTRONICS INC.

Inventor： Kitae AN ,  Bongchu SHIM ,  Jinhyung JUN

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67259 ,  H01L21/6833 ,  H01L25/0753

Abstract: Embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. Electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.