公开(公告)号：US20220319892A1

公开(公告)日：2022-10-06

申请号：US17628776

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Hyeyoung YANG ,  Jisoo KO ,  Wonjae CHANG

IPC: H01L21/68 ,  H01L21/683

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

公开(公告)号：US20220278082A1

公开(公告)日：2022-09-01

申请号：US17632058

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohee KIM ,  Gunho KIM ,  Yongil SHIN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L23/00

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

公开(公告)号：US20210399160A1

公开(公告)日：2021-12-23

申请号：US17289549

申请日：2019-10-08

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM

IPC: H01L33/00 ,  H01L25/075

Abstract: Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.

公开(公告)号：US20200303592A1

公开(公告)日：2020-09-24

申请号：US16894262

申请日：2020-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.

公开(公告)号：US20170032735A1

公开(公告)日：2017-02-02

申请号：US15070791

申请日：2016-03-15

Applicant: LG ELECTRONICS INC.

Inventor： Jaewoon LEE ,  Chisun KIM ,  Janghwan CHO ,  Bongchu SHIM

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G3/3225 ,  G09G2300/0426 ,  G09G2310/0221 ,  G09G2310/0264 ,  G09G2310/0278 ,  G09G2310/0281 ,  G09G2310/08 ,  G09G2380/02

Abstract: A display device including semiconductor light-emitting diodes; a plurality of scan lines configured to transmit a scan driving signal to the semiconductor light-emitting diodes and located parallel to each other; a plurality of data lines intersecting the scan lines and configured to transmit a data driving signal to the semiconductor light-emitting diodes; and a first driver and a second driver connected to the scan lines and the data lines and configured to provide the scan driving signal and the data driving signal. Further, the data lines are split into a first data group of data lines connected to the first driver and a second data group of data lines connected to the second driver.

Abstract translation: 一种显示装置，包括半导体发光二极管; 多个扫描线，被配置为将扫描驱动信号发送到所述半导体发光二极管并且彼此平行; 与扫描线相交的多个数据线，被配置为向半导体发光二极管发送数据驱动信号; 以及连接到扫描线和数据线的第一驱动器和第二驱动器，并且被配置为提供扫描驱动信号和数据驱动信号。 此外，数据线被分割成连接到第一驱动器的数据线的第一数据组和连接到第二驱动器的数据线的第二数据组。

公开(公告)号：US20230163248A1

公开(公告)日：2023-05-25

申请号：US17798812

申请日：2020-02-17

Applicant: LG ELECTRONICS INC.

Inventor： Jinsung KIM ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/005

Abstract: Discussed is a self-assembly apparatus of a semiconductor light emitting diode. The self-assembly apparatus can include a fluid chamber including a space to accommodate a fluid and semiconductor light emitting diodes having a magnetic metal, a magnet to apply a magnetic force to the semiconductor light emitting diodes in a state where an assembly surface of a board is submerged in the fluid, a power supply portion to induce an electric field between assembly electrodes provided on the board so that the semiconductor light emitting diodes become seated at predetermined positions of the board while the semiconductor light emitting diodes are moved by a change in a position of the magnet, and a repair portion disposed in the fluid chamber and to separate some of the semiconductor light emitting diodes seated on the board from the board. The repair portion can be configured to spray and suction the fluid.

公开(公告)号：US20220367423A1

公开(公告)日：2022-11-17

申请号：US17638163

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohwan YANG ,  Dohee KIM ,  Yongil SHIN ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.

公开(公告)号：US20220328335A1

公开(公告)日：2022-10-13

申请号：US17618108

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Jinsung KIM ,  Hyunho LEE ,  Gunho KIM

IPC: H01L21/68 ,  H01L25/075 ,  H01L21/683

Abstract: Discussed is an assembly board for use in a method for manufacturing a display device which allows semiconductor light emitting diodes to be seated at preset positions on the assembly board using an electric field and a magnetic field, the assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs having a plurality of grooves for guiding the semiconductor light emitting diodes to the preset positions and formed on the base portion, wherein each of the plurality of grooves is arranged to overlap only one assembly electrode of the plurality of assembly electrodes such that an electric field is formed between the plurality of grooves adjacent to each other.

公开(公告)号：US20220302092A1

公开(公告)日：2022-09-22

申请号：US17833624

申请日：2022-06-06

Applicant: LG ELECTRONICS INC.

Inventor： Changseo PARK ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: Discussed is a display device, including a substrate including a dielectric layer, a plurality of semiconductor light-emitting devices respectively accommodated on the substrate, and a first electrode provided with a plurality of electrode lines arranged on a bottom of the substrate. Each of the first electrode includes a pair of electrode lines spaced from each other on an upper surface of the dielectric layer among the plurality of electrode lines. Each semiconductor light-emitting device is disposed on the pair of electrode lines, and the pair of electrode lines have the same electrical pole.

公开(公告)号：US20200279826A1

公开(公告)日：2020-09-03

申请号：US16689810

申请日：2019-11-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Dohee KIM

IPC: H01L23/00 ,  H01L25/075 ,  H01L33/00

Abstract: An assembly apparatus for assembling a semiconductor light emitting diode to a display panel according to an embodiment of the present disclosure includes: an assembly module including at least one magnetic member coming in contact with a surface of the display, and a magnetic member accommodator having at least one magnetic member accommodation hole; and a rotary module connected to the assembly module and configured to rotate the assembly module along an orbit on the basis of a driving force transmitted from an external driving source.