公开(公告)号：US10203761B2

公开(公告)日：2019-02-12

申请号：US14588751

申请日：2015-01-02

Applicant: LG ELECTRONICS INC.

Inventor： Jungtae Seo ,  Wonsang Yi ,  Chaemin Lim ,  Wonsul Jeon ,  Bomi Noh

IPC: G06F3/048 ,  G06F3/01 ,  G06F3/0482 ,  G06F3/0486 ,  G06F3/0488

Abstract: A glasses type mobile terminal including a camera configured to obtain an image; a display unit including a transparent display; and a controller configured to recognize a user is gazing at their hand, display an execution screen in a first transparent display area corresponding to a palm of the hand, recognize a first gesture corresponding to a virtual connection between the execution screen and a specific finger, associate the execution screen with the specific finger upon recognition of the first gesture, display a first item indicating association of the execution screen with the specific finger in a second transparent display area corresponding to the specific finger, recognize a second gesture of virtually connecting the first item with the displayed execution screen corresponding to the palm of the hand, and display a result of executing the first item to the application in the first transparent display area.

公开(公告)号：US11647586B2

公开(公告)日：2023-05-09

申请号：US17221334

申请日：2021-04-02

Applicant: LG ELECTRONICS INC.

Inventor： Sanggeun Kim ,  Jungtae Seo ,  Kipoung Kim ,  Inkyu Park ,  Youngjik Lee ,  Youngkweon Kim

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H05K9/00 ,  G06F1/16 ,  H04B1/3888

CPC classification number: H05K1/145 ,  G06F1/1626 ,  H05K1/112 ,  H05K1/181 ,  H05K9/0024 ,  H04B1/3888 ,  H05K2201/09063 ,  H05K2201/09609 ,  H05K2201/10098 ,  H05K2201/10378

Abstract: A substrate layered structure including a first circuit board; a second circuit board overlapping the first circuit board; and interposer blocks interposed between the first circuit board and the second circuit board and spaced apart from each other. Further, each corresponding interposer block includes a dielectric block body; a plurality of signal via holes passing through the dielectric block body and transferring signals between the first circuit board and the second circuit board; and a plurality of signal pads arranged at first ends of the signal via holes and connected to the first circuit board and arranged at second ends of the signal via holes and connected to the second circuit board.