公开(公告)号：US20230361095A1

公开(公告)日：2023-11-09

申请号：US18028606

申请日：2020-09-28

Applicant: LG ELECTRONICS INC.

Inventor： Joodo PARK ,  Hooyoung SONG ,  Myungshin CHOI

IPC: H01L25/16 ,  H01L33/36 ,  H01L33/00 ,  H01L33/14 ,  H01L33/44

CPC classification number: H01L25/167 ,  H01L33/36 ,  H01L33/0093 ,  H01L33/14 ,  H01L33/44 ,  H01L2933/0033

Abstract: Embodiments relate to a method for manufacturing a semiconductor light emitting device package, a semiconductor light emitting device package manufactured by the method, and a display device including the same. The semiconductor light emitting device package according to the embodiment can include a first semiconductor layer on a growth substrate, a tether layer on the first semiconductor layer, a light emitting structure on the tether layer, a light-transmitting electrode layer on the light-emitting structure, and a post structure on the light-transmitting electrode layer.