DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20240304774A1

    公开(公告)日:2024-09-12

    申请号:US18575361

    申请日:2022-06-24

    CPC classification number: H01L33/62 H01L25/0753

    Abstract: The display device according to the embodiment includes a substrate; a first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other; a first insulating layer disposed between the first assembly wiring and the second assembly wiring and having different first and second thicknesses; a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening; and a light emitting device disposed inside the first opening, wherein a first electrode overlaps the first assembly wiring and the second assembly wiring, wherein the first electrode is configured to be electrically connected to either the first assembly wiring or the second assembly wiring.

    LAMP EMPLOYING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20220026036A1

    公开(公告)日:2022-01-27

    申请号:US17257771

    申请日:2018-09-27

    Abstract: Discussed are a lamp or a lamp device employing a semiconductor light-emitting element to have a high degree of luminance uniformity. A lamp includes a circuit board; a bus electrode formed along one direction on the circuit board; electrode lines on the circuit board to extend from the bus electrode; semiconductor light-emitting elements arranged in the direction in which the electrode lines are formed, and spaced a predetermined distance apart from a nearby electrode line; transparent electrodes for electrically connecting the semiconductor light-emitting elements to the electrode lines; a current input unit formed along the one direction in parallel to the bus electrode; and connecting electrodes arranged between the bus electrode and the current input unit along the one direction, to electrically connect the bus electrode to the current input unit, wherein a resistance value of certain of the connecting electrodes is different from a resistance value of the rest.

    FABRICATION METHOD OF PLATE PATTERN
    4.
    发明申请
    FABRICATION METHOD OF PLATE PATTERN 有权
    板形图的制作方法

    公开(公告)号:US20150309350A1

    公开(公告)日:2015-10-29

    申请号:US14698405

    申请日:2015-04-28

    Abstract: Disclosed herein is a fabrication method of a plate pattern including preparing an object on which the plate pattern will be formed, disposing hybrid particles having a hybrid structure of organic and inorganic substances on one surface of the object into a single layer, etching at least the hybrid particles, forming the plate pattern on the surface of the object on which the hybrid particles are disposed, and removing the hybrid particles.

    Abstract translation: 本发明公开了一种板状图案的制造方法,其特征在于,包括准备形成有板状图案的物体,将具有有机物和无机物的混合结构的混合粒子放置在物体的一个表面上,至少蚀刻 混合颗粒,在其上配置有混合颗粒的物体的表面上形成板图案,并除去杂化颗粒。

    IMAGE PROJECTION DEVICE
    5.
    发明公开

    公开(公告)号:US20240210804A1

    公开(公告)日:2024-06-27

    申请号:US18288758

    申请日:2021-04-29

    Inventor: Hooyoung SONG

    CPC classification number: G03B21/2033 G03B21/2013 G03B21/208

    Abstract: An image projection device can comprise a light source configured to output light corresponding to an image, and an optical system disposed in front of the light source and configured to project the image.
    The light source can comprise a substrate comprising a plurality of pixels and a plurality of semiconductor light emitting devices in the plurality of pixels of the substrate, respectively. The substrate can be disposed to be inclined with respect to the optical system, and the semiconductor light emitting device can emit a first condensed light having a first beam angle inclined with respect to the substrate.

    VEHICLE LAMP USING SEMICONDUCTOR LIGHT-EMITTING DEVICE

    公开(公告)号:US20230023206A1

    公开(公告)日:2023-01-26

    申请号:US17781228

    申请日:2020-02-10

    Inventor: Hooyoung SONG

    Abstract: The present invention relates to a vehicle lamp and, more particularly, to a vehicle lamp using a semiconductor light-emitting device. The present invention provides a vehicle lamp comprising: a substrate; first and second bar-shaped light sources arranged parallel to one side of the substrate and extending along one direction thereof; and a lens disposed on one surface of the substrate and extending along the one direction so as to overlap with the first and second light sources, wherein the cross-section of the lens, which is perpendicular to the extending directions of the two light sources and cut along a virtual plane perpendicular to the substrate, includes a part of an ellipse.

    VEHICLE LAMP USING SEMICONDUCTOR LIGHT EMITTING DEVICE

    公开(公告)号:US20190219244A1

    公开(公告)日:2019-07-18

    申请号:US16028018

    申请日:2018-07-05

    CPC classification number: F21S43/14 F21Y2115/10 H01L33/10 H01L33/36 H01L33/62

    Abstract: The present invention relates to a vehicle lamp using a semiconductor light emitting device, and the vehicle lamp includes a light source unit to emit light. The light source unit includes a substrate having a reflective film, a semiconductor light emitting device coupled to the substrate, an insulating layer stacked on the reflective film to surround the semiconductor light emitting device, a first electrode and a second electrode disposed on an upper surface of the insulating layer, and light-transmitting connection electrodes extending from the first and second electrodes, respectively, electrically connected to the semiconductor light-emitting device, and covering an upper surface of the semiconductor light-emitting device.

    DISPLAY APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE

    公开(公告)号:US20210376211A1

    公开(公告)日:2021-12-02

    申请号:US17291145

    申请日:2019-11-05

    Inventor: Hooyoung SONG

    Abstract: Discussed is a display apparatus, including at least one horizontal semiconductor light emitting device having a first conductive electrode and a second conductive electrode; first and second wirings spaced apart from each other on a substrate, and electrically connected to the first and second conductive electrodes, respectively; a first bump disposed between the first wiring and the first conductive electrode; and a second bump disposed between the second wiring and the second conductive electrode, wherein at least one of the first and second bumps protrudes toward the other one from an edge of either one of the first and second wirings.

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