公开(公告)号：US20210257280A1

公开(公告)日：2021-08-19

申请号：US17038429

申请日：2020-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Siho CHOI ,  Seongmoo Cho ,  Oksun Yu ,  Kwangsoo Kim ,  Gun Lee

IPC: H01L23/495 ,  H05K7/02

Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.

公开(公告)号：US10582574B2

公开(公告)日：2020-03-03

申请号：US15048371

申请日：2016-02-19

Applicant: LG ELECTRONICS INC.

Inventor： Seungbok Ok ,  Dooyong Oh ,  Oksun Yu ,  Hyunwook Moon

IPC: H05B6/06 ,  H05B1/02 ,  H05B6/12

Abstract: An induction heat cooking apparatus includes a rectifier to rectify an input voltage and to output a DC voltage; a plurality of switching elements to switch the DC voltage output from the rectifier; a plurality of heating coils to heat a cooking container according to an operation of the plurality of switching elements; and a control part to control the plurality of switching elements, wherein the control part controls a time at which a switching element between a heating coil which is operated and a heating coil which is not operated among the plurality of heating coils is opened to be earlier than that of another switching element, such that power is not applied to the heating coil which is not operated.

公开(公告)号：US11756867B2

公开(公告)日：2023-09-12

申请号：US17038429

申请日：2020-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Siho Choi ,  Seongmoo Cho ,  Oksun Yu ,  Kwangsoo Kim ,  Gun Lee

IPC: H01L23/495 ,  H05K7/02

CPC classification number: H01L23/49524 ,  H01L23/49541 ,  H01L23/49579 ,  H05K7/026

Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.

公开(公告)号：US10667332B2

公开(公告)日：2020-05-26

申请号：US15189395

申请日：2016-06-22

Applicant: LG ELECTRONICS INC.

Inventor： Dooyong Oh ,  Oksun Yu ,  Seungbok Ok ,  Byeongwook Park

IPC: H05B6/06 ,  H05B6/12

Abstract: An electronic induction heat cooking apparatus includes first and second cooker modules including at least one heating coil and a dual heating coil, the first cooker module includes any one of an inner coil and an outer coil included in the dual heating coil, switching elements for operating the coil and a first microcontroller unit for controlling the switching elements, the second cooker module includes the other of the inner coil and the outer coil included in the dual heating coil, switching elements for operating the other coil and a second microcontroller unit for controlling the switching elements, and the first microcontroller unit and the second microcontroller unit share an oscillator.