公开(公告)号：US11735557B2

公开(公告)日：2023-08-22

申请号：US17207086

申请日：2021-03-19

Applicant: LG Electronics Inc.

Inventor： Siho Choi ,  Seongmoo Cho ,  Kwangsoo Kim ,  Gun Lee

IPC: H01L23/00 ,  H01L23/373 ,  H01L25/065

CPC classification number: H01L24/29 ,  H01L23/3733 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/33 ,  H01L25/0655 ,  H01L2224/29247 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83815 ,  H01L2924/13055

Abstract: A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.

公开(公告)号：US20210210411A1

公开(公告)日：2021-07-08

申请号：US17034458

申请日：2020-09-28

Applicant: LG ELECTRONICS INC.

Inventor： Seongmoo Cho ,  Kwangsoo Kim ,  Siho Choi ,  Gun Lee

IPC: H01L23/473 ,  H01L25/07

Abstract: The present disclosure provides a power module including a substrate, an electronic element provided on the substrate, and a cooling fin portion provided on one surface of the substrate to form a flow path portion through which cooling water flows. The cooling fin portion is formed asymmetrically so that amounts of heat transferred by the cooling water acting on the electronic element are different.
As a result, regions in which heat is directly transferred between cooling water and the electronic element can be increased and a pressure drop of cooling water flowing through the flow path portion can be prevented by the cooling fin portion forming an asymmetrical structure of the flow path portion. In addition, a heat dissipation performance of the power module by the cooling water can be further improved.

公开(公告)号：US11756867B2

公开(公告)日：2023-09-12

申请号：US17038429

申请日：2020-09-30

Applicant: LG ELECTRONICS INC.

Inventor： Siho Choi ,  Seongmoo Cho ,  Oksun Yu ,  Kwangsoo Kim ,  Gun Lee

IPC: H01L23/495 ,  H05K7/02

CPC classification number: H01L23/49524 ,  H01L23/49541 ,  H01L23/49579 ,  H05K7/026

Abstract: A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.