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公开(公告)号:US20240125562A1
公开(公告)日:2024-04-18
申请号:US18378941
申请日:2023-10-11
Applicant: LG ELECTRONICS INC.
Inventor: Sukyoung Lee , Sangyeul Lee , Jaeyoung Kim
IPC: F28F1/12
CPC classification number: F28F1/128 , F28F2215/08
Abstract: A heat exchanger includes a heat transfer pipe for guiding a refrigerant; and a plurality of fins which respectively have a through-hole through which the heat transfer pipe passes and are disposed spaced apart from each other to allow air to pass in a first direction, wherein the fin includes: a corrugated form portion having an inclination with the first direction which is an air flow direction; and a sheet portion comprising a surface parallel to the first direction around the through hole, the sheet portion has a first length in the first direction which is an air flow direction, and has a second length longer than the first length in a second direction perpendicular to the air flow direction.
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公开(公告)号:US20240247879A1
公开(公告)日:2024-07-25
申请号:US18414073
申请日:2024-01-16
Applicant: LG ELECTRONICS INC.
Inventor: Sangyeul Lee , Sukyoung Lee , Jaeyoung Kim , Eungyul Lee
CPC classification number: F28F1/128 , F28F1/30 , F28F2215/08
Abstract: A heat exchanger includes a heat transfer tube configured to guide a refrigerant, and a plurality of fins each having a through-hole through which the heat transfer tube is vertically installed, the plurality of fins being spaced apart from each other to allow air to pass in a first direction. Each of the plurality of fins includes a corrugated portion formed in a zigzag shape in the first direction, a sheet portion surrounding the through-hole and a connecting portion connecting the sheet portion and the corrugated portion, wherein an inclined contact point, which is the highest position of the connecting portion and the corrugated portion, is located lower than a valley portion contact point, which is the lowest position of the connecting portion and the corrugated portion, in a second direction perpendicular to the first direction.
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公开(公告)号:US12104861B2
公开(公告)日:2024-10-01
申请号:US17621450
申请日:2020-07-09
Applicant: LG ELECTRONICS INC.
Inventor: Jiwon Choi , Sukyoung Lee , Hanchoon Lee
CPC classification number: F28D7/1607 , F28D7/12 , F28F9/22 , F28F2009/226
Abstract: A heat exchanger according to an embodiment of the present disclosure includes a housing, a gas inflow pipe configured to flow exhaust gas in the housing and a gas exhaust pipe configured to discharge the exhaust gas to the outside of the housing, a cooling water inflow pipe configured to flow cooling water in the housing and a cooling water outflow pipe configured to flow out the cooling water heat-exchanged with the exhaust gas to the outside of the housing, a plurality of tubes extending in the housing in the longitudinal direction of the housing and through which the cooling water flowing therein through the cooling water inflow pipe flows, and a plurality of baffles which are installed in the housing to insert the plurality of tubes thereinto and which are spaced apart from each other by a predetermined distance and are disposed, in which the baffle may be a first curved part configured to extend to be rounded with a first curvature, a first straight part configured to extend linearly from one end part of the first curved part, a second straight part configured to extend linearly from the other end part of the first curved part, and a second curved part positioned between the first and second straight parts and configured to extend to be rounded with a second curvature, and the first straight part and the second straight part may be formed in a direction crossing each other.
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