Light emitting device package
    1.
    发明授权
    Light emitting device package 有权
    发光装置封装

    公开(公告)号:US09012943B2

    公开(公告)日:2015-04-21

    申请号:US13951247

    申请日:2013-07-25

    CPC classification number: H01L33/504 H01L33/507 H01L33/508

    Abstract: A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.

    Abstract translation: 公开了一种半导体器件,更具体地,涉及可用于照明设备的发光器件封装。 发光器件封装包括封装体,位于封装主体上的发光器件,发光器件发射具有第一波长带的光发射器件,位于发光器件上方的距离在其间的透明衬底,波长转换层 位于所述透明基板上,其中所述波长转换层将具有所述第一波长带的光的至少一部分吸收并转换成具有第二波长带的光,以及位于所述波长转换层上的颜色校准层,所述颜色校准层 校准波长转换层的颜色。

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