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公开(公告)号:US09012943B2
公开(公告)日:2015-04-21
申请号:US13951247
申请日:2013-07-25
Applicant: LG Electronics Inc.
Inventor: Daehyun Park , Gunyoung Hong , Younggil Yoo , Dongwon Kang
IPC: H01L33/50
CPC classification number: H01L33/504 , H01L33/507 , H01L33/508
Abstract: A semiconductor device, and more particularly a light emitting device package usable with a lighting apparatus is disclosed. The light emitting device package comprises a package body, a light emitting device located on the package body, the light emitting device emitting light having a first wavelength band, a transparent substrate located over the light emitting device with a distance therebetween, a wavelength conversion layer located on the transparent substrate, wherein the wavelength conversion layer absorbs and converts at least a part of the light having the first wavelength band into light having a second wavelength band, and a color calibration layer located on the wavelength conversion layer, the color calibration layer calibrating color of the wavelength conversion layer.
Abstract translation: 公开了一种半导体器件,更具体地,涉及可用于照明设备的发光器件封装。 发光器件封装包括封装体,位于封装主体上的发光器件,发光器件发射具有第一波长带的光发射器件,位于发光器件上方的距离在其间的透明衬底,波长转换层 位于所述透明基板上,其中所述波长转换层将具有所述第一波长带的光的至少一部分吸收并转换成具有第二波长带的光,以及位于所述波长转换层上的颜色校准层,所述颜色校准层 校准波长转换层的颜色。
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公开(公告)号:US11933754B2
公开(公告)日:2024-03-19
申请号:US17295750
申请日:2019-12-06
Applicant: LG ELECTRONICS INC.
Inventor: Myungwon Lee , Daehyun Park , Hyunchul Kim , Soonyoung Min
CPC classification number: G01N27/228 , G01N33/02 , H01Q1/38 , H01Q7/00 , H05K1/092 , H05K1/16 , H05K2201/10098
Abstract: The present invention provides a sensor comprising: a substrate; an antenna pattern formed in a spiral shape on the substrate; first and second electrodes formed on the substrate and spaced apart from each other in parallel; a circuit wiring formed to be connected to each of the first and second electrodes; and an element bonded to the antenna pattern and the circuit wiring, wherein cross sections of the first and second electrodes have a curvature.
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