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公开(公告)号：US20150159889A1
公开(公告)日：2015-06-11
申请号：US14547209
申请日：2014-11-19
Applicant: LG ELECTRONICS INC.
Inventor： Jongchul HA , Jiwon CHANG , Yeol LEE , Hyunjong KIM
CPC classification number: F25B49/02 , F24F3/153 , F24F2003/144 , F24F2013/227 , F24F2140/30
Abstract: A dehumidifier includes a body having an inlet for suctioning air and an outlet for discharging air; a compressor, disposed at the body, for compressing a refrigerant; a condenser for condensing the refrigerant compressed from the compressor; an expander for expanding the refrigerant condensed from the condenser; an evaporator, disposed at upstream of the condenser according to the flow direction of air, for evaporating the refrigerant expanded from the expander; a condensate water tank to store condensate water condensed from the evaporator; and a condensate water pipe, connected to the condensate water tank, for flowing the condensate water to be heat-exchanged with the refrigerant compressed from the compressor.
Abstract translation: 除湿器包括具有用于吸入空气的入口和用于排出空气的出口的主体; 压缩机，设置在所述主体处，用于压缩制冷剂; 用于冷凝从压缩机压缩的制冷剂的冷凝器; 用于膨胀从冷凝器冷凝的制冷剂的膨胀器; 蒸发器，其根据空气的流动方向设置在冷凝器的上游，用于蒸发从膨胀器膨胀的制冷剂; 冷凝水箱，用于存储从蒸发器冷凝的冷凝水; 以及连接到冷凝水箱的冷凝水管，用于使与从压缩机压缩的制冷剂进行热交换的冷凝水流动。
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公开(公告)号：US20250035348A1
公开(公告)日：2025-01-30
申请号：US18769551
申请日：2024-07-11
Applicant: LG ELECTRONICS INC.
Inventor： Seungtaek OH , Hyunjong KIM , Kyoungmin KWON
Abstract: The present disclosure relates to a heat supplier. The heat supplier includes: a compressor to compress a refrigerant; a first heat exchanger to exchange heat between air and the refrigerant; a second heat exchanger to exchange heat between water and the refrigerant; a switching valve to direct the refrigerant discharged from the compressor into the first heat exchanger or the second heat exchanger; a third heat exchanger to exchange heat between refrigerant flowing through a liquid pipe, which connects the first heat exchanger and the second heat exchanger, and refrigerant branched from the liquid pipe and expanded; a first expansion valve to expand refrigerant flowing from the third heat exchanger to the first heat exchanger; and a second expansion valve to expand refrigerant flowing from the third heat exchanger to the second heat exchanger. The first expansion valve and the second expansion valve are selectively opened and closed according to a direction of the refrigerant flowing through the third heat exchanger, allowing the refrigerant that has passed through the third heat exchanger to flow into the first expansion valve or the second expansion valve.
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公开(公告)号：US20250027695A1
公开(公告)日：2025-01-23
申请号：US18775618
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger connected to the compressor and exchanging heat between refrigerant and water; a second heat exchanger connected to the compressor and exchanging heat between refrigerant and air; and a gas-liquid separator separating refrigerant into gaseous refrigerant and liquid refrigerant, the gas-liquid separator including: a housing; and a penetration pipe passing through sides of the housing and including an inlet flow path through which mixed refrigerant flows in and an outlet flow path through which gaseous refrigerant flows out, and the penetration pipe including: a first connecting hole formed on a surface and connecting the inlet flow path and the inside of the housing; a second connecting hole formed on a surface and connecting the outlet flow path and the inside of the housing; and a separation plate partitioning the inlet flow path and the outlet flow path.
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公开(公告)号：US20240426530A1
公开(公告)日：2024-12-26
申请号：US18748380
申请日：2024-06-20
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat pump may include a compressor configured to compress a refrigerant; an accumulator configured to supply the refrigerant to the compressor; a receiver connected to the accumulator; a fluid-refrigerant heat exchanger configured to exchange heat between a fluid, such as water, and the refrigerant; an outdoor heat exchanger configured to exchange heat between outdoor air and the refrigerant; a 4-way valve configured to guide the refrigerant, discharged from the compressor, to flow into the fluid-refrigerant heat exchanger or the outdoor heat exchanger; at least one expansion valve disposed between the fluid-refrigerant heat exchanger and the outdoor heat exchanger; a first valve disposed between the fluid-refrigerant heat exchanger and the receiver; a second valve disposed between the compressor and the receiver; and a third valve disposed between the receiver and the accumulator.
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公开(公告)号：US20250027691A1
公开(公告)日：2025-01-23
申请号：US18775444
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and outdoor air, wherein the second heat exchanger includes a plurality of pipes through which refrigerant flows; and a valve adjusting the flow of refrigerant through the lowermost pipe of the plurality of pipes, and the valve allows refrigerant to flow only in a first direction that sequentially passes the compressor, the second heat exchanger, and the indoor heat exchanger.
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Patent Agency Ranking
公开(公告)号：US20150338145A1
公开(公告)日：2015-11-26
申请号：US14719812
申请日：2015-05-22
Applicant: LG ELECTRONICS INC.
Inventor： Kidong KIM , Jongchul HA , Jiwon CHANG , Hyunjong KIM
CPC classification number: F25B49/022 , F25B6/02 , F25B7/00 , F25B13/00 , F25B30/02 , F25B47/02 , F25B49/02 , F25B2313/0254 , F25B2600/0251 , F25D21/12
Abstract: A heat pump includes a first cycle device and a second cycle device. The first cycle device is connected such that, in a heating operation, a first refrigerant is circulated in an order of a first compressor, a 4-way valve, a first heat exchanger, a second heat exchanger, a first expansion mechanism, a third heat exchanger, the 4-way valve, and the first compressor, and such that, in a cooling operation, the first refrigerant is circulated in an order of the first compressor, the 4-way valve, the third heat exchanger, the first expansion mechanism, the second heat exchanger, the first heat exchanger, the 4-way valve, and the first compressor. The second cycle device is connected such that a second refrigerant is circulated in an order of a second compressor, a fourth heat exchanger, a second expansion mechanism, the second heat exchanger, and the second compressor.
Abstract translation: 热泵包括第一循环装置和第二循环装置。 连接第一循环装置，使得在制热运转中，第一制冷剂按照第一压缩机，四通阀，第一热交换器，第二换热器，第一膨胀机构，第三换热器 热交换器，四通阀和第一压缩机，并且在冷却运转中，第一制冷剂按照第一压缩机，四通阀，第三换热器，第一膨胀器的顺序循环 机构，第二热交换器，第一热交换器，四通阀和第一压缩机。 第二循环装置被连接成使得第二制冷剂按照第二压缩机，第四热交换器，第二膨胀机构，第二热交换器和第二压缩机的顺序循环。
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公开(公告)号：US20150159920A1
公开(公告)日：2015-06-11
申请号：US14565296
申请日：2014-12-09
Applicant: LG Electronics Inc.
Inventor： Jongchul HA , Jiwon CHANG , Yeol LEE , Hyunjong KIM
CPC classification number: F25B49/02 , F24F3/153 , F24F2003/144 , F25B5/02 , F25B2600/2513
Abstract: A dehumidifier is provided. The dehumidifier includes a main body having a suction part into which air is suctioned, the main body having a discharge part through which the air is discharged, a compressor disposed in the main body to compress a refrigerant, a second heat-exchange part receiving the compressed refrigerant from the compressor, and first and third heat-exchange parts disposed in the main body to receive the refrigerant condensed by the second heat-exchange part. The air suctioned through the suction part successively passes through the first, second, and third heat-exchange parts.
Abstract translation: 提供除湿器。 所述除湿机具有主体，所述主体具有吸入空气的抽吸部，所述主体具有排出部，所述排出部通过所述排出部排出空气;压缩机，设置在所述主体内以压缩制冷剂;第二热交换部， 来自压缩机的压缩制冷剂，以及设置在主体中的第一和第三热交换部，以接收由第二热交换部冷凝的制冷剂。 通过抽吸部抽吸的空气依次通过第一，第二和第三热交换部。
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公开(公告)号：US20250027678A1
公开(公告)日：2025-01-23
申请号：US18775859
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Doyong HA , Jeongseob SHIN , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
IPC: F24H4/02 , F25B41/325
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; a second heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and air; a first expansion device disposed in a refrigerant pipe connecting the first heat exchanger and the second heat exchanger; a second expansion device connected to the first expansion device in parallel and opened and closed according to an electrical signal; and a controller controlling the degree of opening of the second expansion device, wherein, if heating operation is started, and temperature of water flowing into the first heat exchanger is higher than temperature of refrigerant flowing into the first heat exchanger, the controller opens the second expansion device.
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公开(公告)号：US20250027677A1
公开(公告)日：2025-01-23
申请号：US18775751
申请日：2024-07-17
Applicant: LG ELECTRONICS INC.
Inventor： Jeongseob SHIN , Doyong HA , Seungtaek OH , Hyunjong KIM , Kyongmin KWON
Abstract: A heat supply apparatus comprises: a compressor compressing refrigerant; a first heat exchanger being connected to the compressor through a refrigerant pipe and exchanging heat between refrigerant and water; and a second heat exchanger being connected to the compressor through a refrigerant pipe and having a plurality of pipes exchanging heat between refrigerant and air, wherein the plurality of pipes include: a first pipe disposed in the lowermost part; and the second pipes disposed above the first pipe, wherein the first pipe directs refrigerant flow in the opposite direction to the refrigerant flow in the remaining pipes.
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公开(公告)号：US20240421272A1
公开(公告)日：2024-12-19
申请号：US18734962
申请日：2024-06-05
Applicant: LG ELECTRONICS INC.
Inventor： Hongkey PARK , Naree KIM , Hyunjong KIM , Dongkyu LEE , Jeongsik CHOI
Abstract: The present disclosure is applicable to a display device related technical field and relates to a display device using a composite optical film and a light emitting element for example. The present disclosure may include a wiring substrate, an electrode pad partitioned on the wiring substrate, a multitude of light emitting elements forming a unit pixel by being connected to the electrode pad, an optical film layer forming a film on a multitude of the light emitting elements and including a filler, and an encapsulation layer positioned on the optical film layer.
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