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公开(公告)号:US20240009698A1
公开(公告)日:2024-01-11
申请号:US18036555
申请日:2022-06-15
发明人: Sangjin Seo , Gil Seon Lee , Chang Bum Ahn , Yeongcheol Jang , Jea Bong Jung
CPC分类号: B05C11/1026 , B05C11/1039 , H01M4/0404
摘要: The present invention relates to a system for circulating a slurry including, a coating die for applying a electrode active material slurry on the current collector; a tank for supplying the electrode active material slurry to the coating die; and a circulation piping for connecting the coating die and the tank, wherein the slurry circulates through the circulation piping connected from at least one of the left surface, the right surface, the rear surface, and the lower surface of the coating die to the tank at the time of a line stop.
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公开(公告)号:US20240266582A1
公开(公告)日:2024-08-08
申请号:US18273367
申请日:2022-06-17
发明人: Jea Bong Jung , Chang Bum Ahn , Sangjin Seo , Dongguk Sim , Yeongcheol Jang
IPC分类号: H01M10/04 , H01M50/466
CPC分类号: H01M10/0418 , H01M10/0468 , H01M50/466
摘要: Provided is an electrode assembly manufacturing process comprising the following steps. First, wrapping a second separator around a laminate structure having alternating layers of positive electrodes, first separators, and negative electrodes. Second, simultaneously pressing the upper end and the lower end of the laminate structure including the second separator-3-2 to strengthen the adhesive strength between each layer of the laminate structure. Third, bonding the excess portions of the second separator-3-2 surrounding the structure, thereby adjusting to meet the standard requirements of the laminate structure. And fourth, bonding each of the bonded portions of the second separator to a respective adjacent portion of the second separator in the lateral dimension. The electrode assembly manufacturing process minimizes damage to the initial structure and allows the wrapping to suit the size of the structure, thereby increasing the utilization value of the electrode assembly.
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公开(公告)号:US20240088496A1
公开(公告)日:2024-03-14
申请号:US18266702
申请日:2022-08-10
发明人: Jea Bong Jung , Dongguk Sim , Chang Bum Ahn , Sangjin Seo , Yeongcheol Jang
IPC分类号: H01M50/197 , H01M10/04 , H01M50/105 , H01M50/178 , H01M50/186 , H01M50/191 , H01M50/193 , H01M50/536
CPC分类号: H01M50/197 , H01M10/0431 , H01M50/105 , H01M50/178 , H01M50/186 , H01M50/191 , H01M50/193 , H01M50/536
摘要: A multilayer conductive tape includes an adhesive layer, an electrically conductive layer positioned on one side of the adhesive layer, an insulating layer positioned on one side of the electrically conductive layer, and a protective layer for protecting an outer surface of the insulating layer.
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