公开(公告)号：US20240407103A1

公开(公告)日：2024-12-05

申请号：US18723616

申请日：2022-12-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Chae Young YOU ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K1/18 ,  H01L23/00 ,  H01L23/13 ,  H05K1/11

Abstract: A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity; wherein the second insulating layer includes a lower surface of the cavity positioned higher than an upper surface of the first insulating layer, wherein the lower surface of the cavity includes: a plurality of first portions, and a plurality of second portions provided between the plurality of first portions and having a height different from that of the plurality of first portions, and wherein a height difference between a portion having a highest height and a portion having a lowest height of the plurality of first portions is 1 μm or less.