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公开(公告)号：US20240237233A9
公开(公告)日：2024-07-11
申请号：US18271544
申请日：2021-04-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Bae SHIN , Soo Min LEE , Jae Hun JEONG
CPC classification number: H05K3/4688 , H05K1/111 , H05K3/0014 , H05K3/4697 , H05K2201/0358
Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.
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公开(公告)号：US20240120243A1
公开(公告)日：2024-04-11
申请号：US18263603
申请日：2021-04-26
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Bae SHIN , Moo Seong KIM , Soo Min LEE , Jae Hun JEONG
IPC: H01L23/13 , H01L21/48 , H01L23/498 , H05K1/18 , H05K3/46
CPC classification number: H01L23/13 , H01L21/4857 , H01L23/49822 , H01L23/49838 , H05K1/183 , H05K3/4644 , H05K2203/0195
Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.
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公开(公告)号：US20250040032A1
公开(公告)日：2025-01-30
申请号：US18580365
申请日：2022-08-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Bae SHIN , Moo Seong KIM , Soo Min LEE , Jae Hun JEONG
Abstract: A circuit board according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer and including a cavity, wherein the cavity of the second substrate layer includes a first part disposed adjacent to an upper surface of the second substrate layer and having a first inclination such that a width gradually decreases toward a lower surface of the second substrate layer; and a second part disposed below the first part adjacent to the lower surface of the second substrate layer and having a second inclination such that a width gradually decreases toward the lower surface of the second substrate layer, and the first inclination of the first part relative to a bottom surface of the cavity is greater than the second inclination of the second part relative to the bottom surface of the cavity, and a vertical length of the first part is different from a vertical length of the second part.
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公开(公告)号：US20250024587A1
公开(公告)日：2025-01-16
申请号：US18714337
申请日：2022-11-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Bae SHIN , Soo Min LEE , Jae Hun JEONG , Ji Chul JUNG
Abstract: A circuit board according to an embodiment includes a first insulating layer; a first pattern layer disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and an upper surface of the first pattern layer and including a cavity, wherein the upper surface of the first insulating layer includes a first upper surface corresponding to a lower surface of the cavity, and a second upper surface having a step difference from the first upper surface and not vertically overlapping the lower surface of the cavity, wherein the first pattern layer includes a first pattern part disposed on the first upper surface, and a second pattern part disposed on the second upper surface, and wherein a thickness of the first pattern part is smaller than a thickness of the second pattern part.
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公开(公告)号：US20200066936A1
公开(公告)日：2020-02-27
申请号：US16466953
申请日：2017-12-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Deok Ki HWANG , Jae Hun JEONG , Ki Bum SUNG , Sang Jun PARK , Tae Yong LEE , Yong Han JEON
Abstract: A semiconductor device disclosed in an embodiment comprises: a light emitting unit comprising a light emitting structure layer which has a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; and a sensor unit disposed on the light emitting unit, wherein the sensor unit comprises: a sensing material changing in resistance with light emitted by the light emitting unit; a first sensor electrode comprising a first pad portion and a first extension part extending from the first pad portion and contacting the sensing material; and a second sensor electrode comprising a first pad portion and a second extension part extending toward the first extension part from the second pad portion and contacting the sensing material. The sensor unit senses an external gas in response to the light generated from the light emitting unit.
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Patent Agency Ranking
公开(公告)号：US20130320379A1
公开(公告)日：2013-12-05
申请号：US13906029
申请日：2013-05-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Bae MOON , Jae Hun JEONG , Sang In YOON
IPC: H01L33/58
CPC classification number: H01L33/58 , C08G59/3218 , C08G59/3245 , C08G59/4215 , C08L63/06 , H01L33/56 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.
Abstract translation: 公开了环氧树脂组合物和发光装置。 环氧树脂组合物包括三嗪衍生物环氧树脂和脂环族环氧树脂。
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公开(公告)号：US20250048557A1
公开(公告)日：2025-02-06
申请号：US18718557
申请日：2022-12-09
Applicant: LG INNOTEK CO., LTD.
Inventor： Soo Min LEE , Jong Bae SHIN , Jae Hun JEONG , Ji Chul JUNG
IPC: H05K1/18 , H01L21/48 , H01L23/13 , H01L23/498 , H01L23/552 , H05K1/02 , H05K1/11 , H05K3/46
Abstract: A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on an upper surface of the first insulating layer, wherein the second insulating layer includes a cavity, and the cavity has a planar shape including a plurality of convex parts convex toward an inner direction of the second insulating layer.
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公开(公告)号：US20240407103A1
公开(公告)日：2024-12-05
申请号：US18723616
申请日：2022-12-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Chae Young YOU , Soo Min LEE , Jae Hun JEONG
Abstract: A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity; wherein the second insulating layer includes a lower surface of the cavity positioned higher than an upper surface of the first insulating layer, wherein the lower surface of the cavity includes: a plurality of first portions, and a plurality of second portions provided between the plurality of first portions and having a height different from that of the plurality of first portions, and wherein a height difference between a portion having a highest height and a portion having a lowest height of the plurality of first portions is 1 μm or less.
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公开(公告)号：US20240282685A1
公开(公告)日：2024-08-22
申请号：US18682829
申请日：2022-08-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Jae Hun JEONG , Jong Bae SHIN , Soo Min LEE
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H01L23/31
CPC classification number: H01L23/49822 , H01L21/481 , H01L23/49838 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13124 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1316 , H01L2224/16227 , H01L2224/29101 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/29118 , H01L2224/2912 , H01L2224/29124 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/32227 , H01L2924/01048 , H01L2924/014
Abstract: A circuit board according to an embodiment includes a first insulating layer, a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and the first circuit pattern layer, wherein the second insulating layer includes a first region including a cavity and a second region excluding the first region, wherein the first region of the second insulating layer includes a first portion concave toward a lower surface of the second insulating layer, and a second portion convex toward an upper surface of the second insulating layer.
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公开(公告)号：US20230328886A1
公开(公告)日：2023-10-12
申请号：US18026917
申请日：2021-09-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Jong Bae SHIN , Soo Min LEE , Jae Hun JEONG
CPC classification number: H05K1/111 , H05K1/185 , H05K1/183 , H05K3/4697
Abstract: A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity, wherein an upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region, the first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer, the first-first circuit pattern includes a first portion that does not vertically overlap the cavity; and a second portion connected to the first portion and vertically overlapping the cavity, and a thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.
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