公开(公告)号：US20190219460A1

公开(公告)日：2019-07-18

申请号：US16313110

申请日：2016-07-11

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Keun CHO ,  Eun Jin KIM ,  Soo Min LEE ,  Jina LEE ,  In Hee CHO ,  Hyun Jin JO ,  Sanga JU

IPC: G01L1/20

CPC classification number: G01L1/20 ,  G01L1/18 ,  H01B1/02

Abstract: A pressure sensor according to an embodiment of the present invention comprises: a first electrode layer; a second electrode layer; and an intermediate layer disposed between the first electrode layer and the second electrode layer, wherein the intermediate layer changes in resistance, depending on a change in at least one of thickness and volume thereof. In addition, the intermediate layer comprises: a foam having porous regions dispersed in a non-porous region thereof; and a conductive material being dispersed in the foam and greater in conductivity rate than the foam.

公开(公告)号：US20250040032A1

公开(公告)日：2025-01-30

申请号：US18580365

申请日：2022-08-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Moo Seong KIM ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K1/02 ,  H01Q1/22 ,  H01Q1/48 ,  H05K1/11

Abstract: A circuit board according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer and including a cavity, wherein the cavity of the second substrate layer includes a first part disposed adjacent to an upper surface of the second substrate layer and having a first inclination such that a width gradually decreases toward a lower surface of the second substrate layer; and a second part disposed below the first part adjacent to the lower surface of the second substrate layer and having a second inclination such that a width gradually decreases toward the lower surface of the second substrate layer, and the first inclination of the first part relative to a bottom surface of the cavity is greater than the second inclination of the second part relative to the bottom surface of the cavity, and a vertical length of the first part is different from a vertical length of the second part.

公开(公告)号：US20250024587A1

公开(公告)日：2025-01-16

申请号：US18714337

申请日：2022-11-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG ,  Ji Chul JUNG

IPC: H05K1/02 ,  H05K1/11

Abstract: A circuit board according to an embodiment includes a first insulating layer; a first pattern layer disposed on an upper surface of the first insulating layer; and a second insulating layer disposed on the upper surface of the first insulating layer and an upper surface of the first pattern layer and including a cavity, wherein the upper surface of the first insulating layer includes a first upper surface corresponding to a lower surface of the cavity, and a second upper surface having a step difference from the first upper surface and not vertically overlapping the lower surface of the cavity, wherein the first pattern layer includes a first pattern part disposed on the first upper surface, and a second pattern part disposed on the second upper surface, and wherein a thickness of the first pattern part is smaller than a thickness of the second pattern part.

公开(公告)号：US20240237233A9

公开(公告)日：2024-07-11

申请号：US18271544

申请日：2021-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20240120243A1

公开(公告)日：2024-04-11

申请号：US18263603

申请日：2021-04-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Moo Seong KIM ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/498 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/183 ,  H05K3/4644 ,  H05K2203/0195

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

公开(公告)号：US20190289951A1

公开(公告)日：2019-09-26

申请号：US16302589

申请日：2017-05-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Jin JO ,  Won Keun CHO ,  Jeong Han KIM ,  Soo Min LEE ,  Ji Na LEE ,  In Hee CHO ,  Sang A JU

IPC: A43B3/00 ,  A43B17/00 ,  G01L1/20 ,  B32B3/26 ,  B32B7/12

Abstract: Disclosed in an embodiment is a pressure detection sensor comprising: an elastic layer including a hole; and an electrode layer including a plurality of electrodes arranged on the elastic layer so as to be spaced apart, wherein the elastic layer includes a variable member arranged in the hole, the plurality of electrodes are electrically connected to each other by outside pressure, and at least one of the plurality of electrodes covers a part of the hole.

公开(公告)号：US20240138077A1

公开(公告)日：2024-04-25

申请号：US18271544

申请日：2021-04-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K3/46 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/4688 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/4697 ,  H05K2201/0358

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

公开(公告)号：US20230290716A1

公开(公告)日：2023-09-14

申请号：US18013624

申请日：2021-06-29

Applicant: LG INNOTEK CO., LTD

Inventor： Jae Hun JEONG ,  Jong Bae SHIN ,  Soo Min LEE

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/46 ,  H01L21/48 ,  H05K3/00 ,  H05K1/03 ,  H01L23/13

CPC classification number: H01L23/49838 ,  H05K1/0298 ,  H05K3/4688 ,  H01L21/4857 ,  H05K3/0032 ,  H05K1/036 ,  H01L23/49894 ,  H01L23/49822 ,  H05K3/4697 ,  H01L23/13 ,  H05K1/186

Abstract: A printed circuit board according to an embodiment comprises: a first insulation layer; a first circuit pattern disposed on one surface of the first insulation layer and including a pad; and a second insulation layer disposed on one surface of the first insulation layer and including a cavity exposing the pad, wherein the first circuit pattern includes a 1-1 metal layer disposed on one surface of the first insulation layer, and a 1-2 metal layer disposed on one surface of the 1-1 metal layer, wherein the area of the 1-1 metal layer is greater than the area of the 1-2 metal layer, and at least a portion of a side surface of the 1-1 metal layer is exposed through the cavity.

公开(公告)号：US20220377902A1

公开(公告)日：2022-11-24

申请号：US17770757

申请日：2020-10-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Jong Bae SHIN ,  Soo Min LEE ,  Jae Hun JEONG

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

公开(公告)号：US20250048557A1

公开(公告)日：2025-02-06

申请号：US18718557

申请日：2022-12-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Soo Min LEE ,  Jong Bae SHIN ,  Jae Hun JEONG ,  Ji Chul JUNG

IPC: H05K1/18 ,  H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L23/552 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46

Abstract: A circuit board according to an embodiment includes a first insulating layer; and a second insulating layer disposed on an upper surface of the first insulating layer, wherein the second insulating layer includes a cavity, and the cavity has a planar shape including a plurality of convex parts convex toward an inner direction of the second insulating layer.