公开(公告)号：US12108531B2

公开(公告)日：2024-10-01

申请号：US17756541

申请日：2020-11-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyo Hun Koo ,  Jin Hak Lee ,  In Ho Jeong

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/0206 ,  H05K1/0218 ,  H05K3/424 ,  H05K2201/09563

Abstract: A circuit board according to an embodiment includes: an insulating layer including a through hole and a via disposed in the through hole and wherein the via including a first metal layer on an upper surface of the insulating layer and an inner wall of the through hole; and a second metal layer disposed in the through hole, and the an upper surface of the second metal layer includes a protruding portion that does not overlap an upper surface of the insulating layer in a vertical direction and is located higher than the first metal layer.