公开(公告)号：US20200058829A1

公开(公告)日：2020-02-20

申请号：US16539421

申请日：2019-08-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sik KIM ,  Won Jung KIM ,  Ki Seok KIM

IPC: H01L33/38 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56

Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.