公开(公告)号：US20200176654A1

公开(公告)日：2020-06-04

申请号：US16636457

申请日：2018-07-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Hee Jeong PARK ,  June O SONG ,  Chang Man LIM

IPC: H01L33/62 ,  H01L33/46 ,  H01L33/40

Abstract: A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.

公开(公告)号：US20200058829A1

公开(公告)日：2020-02-20

申请号：US16539421

申请日：2019-08-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sik KIM ,  Won Jung KIM ,  Ki Seok KIM

IPC: H01L33/38 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56

Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.

公开(公告)号：US20190333896A1

公开(公告)日：2019-10-31

申请号：US16068305

申请日：2017-11-02

Applicant: LG INNOTEK CO., LTD.

Inventor： June O SONG ,  Ki Seok KIM ,  Chang Man LIM

IPC: H01L25/075 ,  H01L23/00

Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a third frame having a third through hole; a fourth frame having a fourth through hole; a body including the first through fourth frames; a connecting frame diagonally extending in the light emitting device package from the second frame to the third frame; a first light emitting device including a first electrode pad and a second electrode pad, the first electrode pad being disposed on the first through hole of the first frame and the second electrode pad being disposed on the second through hole of the second frame; a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the third through hole of the third frame and the fourth electrode pad being disposed on the fourth through hole of the fourth frame; and a plurality of recesses on the body, and interposed between the first frame and the second frame, the plurality of recesses being spaced apart from each other.

公开(公告)号：US20190088824A1

公开(公告)日：2019-03-21

申请号：US15759113

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L33/56

Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.

公开(公告)号：US20210184090A1

公开(公告)日：2021-06-17

申请号：US16769900

申请日：2018-11-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Chang Man LIM ,  Ki Seok KIM

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.

公开(公告)号：US20190334063A1

公开(公告)日：2019-10-31

申请号：US16070484

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56

Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.

公开(公告)号：US20190207062A1

公开(公告)日：2019-07-04

申请号：US16238046

申请日：2019-01-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Ki Seok KIM ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60

Abstract: A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.

公开(公告)号：US20210013376A1

公开(公告)日：2021-01-14

申请号：US16646884

申请日：2018-09-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/56

Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.

公开(公告)号：US20200350474A1

公开(公告)日：2020-11-05

申请号：US16643099

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Young Shin KIM ,  June O SONG ,  Chang Man LIM ,  Won Jung KIM ,  Ki Seok KIM

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/60 ,  H01L33/48

Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.

公开(公告)号：US20200212276A1

公开(公告)日：2020-07-02

申请号：US16643279

申请日：2018-08-31

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  Won Jung KIM ,  June O SONG

IPC: H01L33/60 ,  H01L25/075 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess. The first light emitting device has a first bonding portion and a second bonding portion, and may be arranged on the first resin part and electrically connected to the first frame and the third frame. The second light emitting device has a third bonding portion and a fourth bonding portion, and may be arranged on the second resin part and electrically connected to the second frame and the third frame.