公开(公告)号：US20210193877A1

公开(公告)日：2021-06-24

申请号：US16756952

申请日：2018-10-16

Applicant: LG INNOTEK CO., LTD.

Inventor： June O SONG ,  Ki Seok KIM ,  Won Jung KIM

IPC: H01L33/48 ,  H01L33/62

Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively. According to an embodiment, the first and second frames may include first and second metal layers having third and fourth openings passing through upper and lower surfaces around the first and second openings, respectively, and widths of the first and second bonding parts in a horizontal direction may be greater than widths of upper surfaces of the first and second openings in the horizontal direction.

公开(公告)号：US20190074410A1

公开(公告)日：2019-03-07

申请号：US15766717

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Man LIM ,  Ki Seok KIM ,  Won Jung KIM ,  June O SONG

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/52

Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.

公开(公告)号：US20210184090A1

公开(公告)日：2021-06-17

申请号：US16769900

申请日：2018-11-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Chang Man LIM ,  Ki Seok KIM

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/60

Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.

公开(公告)号：US20190334063A1

公开(公告)日：2019-10-31

申请号：US16070484

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56

Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.

公开(公告)号：US20190207062A1

公开(公告)日：2019-07-04

申请号：US16238046

申请日：2019-01-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jung KIM ,  June O SONG ,  Ki Seok KIM ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60

Abstract: A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.

公开(公告)号：US20190044039A1

公开(公告)日：2019-02-07

申请号：US16052247

申请日：2018-08-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Sung LEE ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/32 ,  H01L33/60 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L33/32 ,  H01L33/36 ,  H01L33/486 ,  H01L33/50 ,  H01L33/60 ,  H01L33/64

Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.

公开(公告)号：US20200058829A1

公开(公告)日：2020-02-20

申请号：US16539421

申请日：2019-08-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Sik KIM ,  Won Jung KIM ,  Ki Seok KIM

IPC: H01L33/38 ,  H01L33/00 ,  H01L33/50 ,  H01L33/56

Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.

公开(公告)号：US20190088824A1

公开(公告)日：2019-03-21

申请号：US15759113

申请日：2017-09-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Won Jung KIM ,  June O SONG ,  Chang Man LIM

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/60 ,  H01L33/54 ,  H01L33/50 ,  H01L33/56

Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus.According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.

公开(公告)号：US20150060897A1

公开(公告)日：2015-03-05

申请号：US14476404

申请日：2014-09-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Bong Kul MIN ,  Won Jung KIM ,  Heung Ju LEE ,  Chang Man LIM

IPC: H01L33/60 ,  H01L33/62 ,  H01L27/15

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Embodiments relate to a light emitting device package including a first lead frame and a second lead frame spaced apart from each other, a light emitting device disposed on the first lead frame, a reflecting part disposed on the first lead frame and the second lead frame and a light transmitting part including a lower end part disposed on the reflecting part, the first lead frame and the second lead frame and an upper end part disposed on the lower end part. The upper end part has a side surface vertically aligned with a location of a sidewall between upper and lower ends of the reflecting part.

Abstract translation: 实施例涉及包括彼此间隔开的第一引线框架和第二引线框架的发光器件封装，设置在第一引线框架上的发光器件，设置在第一引线框架和第二引线框架上的反射部件， 一个透光部分，包括设置在反射部分上的下端部分，第一引线框架和第二引线框架，以及设置在下端部分上的上端部分。 上端部具有与反射部的上端和下端之间的侧壁的位置垂直对准的侧表面。

公开(公告)号：US20210210665A1

公开(公告)日：2021-07-08

申请号：US17059132

申请日：2019-05-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Seok KIM ,  Chang Man LIM ,  Won Jung KIM

IPC: H01L33/62 ,  H01L33/48

Abstract: A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.