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公开(公告)号:US20230114245A1
公开(公告)日:2023-04-13
申请号:US17906161
申请日:2021-03-12
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Kyu LEE , Hyung Kyu YOON , Seung Jin LEE
IPC: G03B5/04 , H02K3/26 , H02K41/035
Abstract: A coil substrate according to an embodiment includes an insulating layer; a first coil pattern portion disposed on one surface of the insulating layer; a second coil pattern portion disposed on the other surface of the insulating layer; and a pad portion disposed on the one surface of the insulating layer and connected to the first coil pattern portion, wherein the first coil pattern portion includes: an inner coil pattern portion; and an outer coil pattern portion spaced apart from the inner coil pattern portion at a predetermined interval and disposed outside the inner coil pattern portion, wherein the pad portion is disposed between the inner coil pattern portion and the outer coil pattern portion.
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公开(公告)号:US20240079174A1
公开(公告)日:2024-03-07
申请号:US18260083
申请日:2022-01-11
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Kyu LEE , Sung Yong PARK , Seung Jin LEE
CPC classification number: H01F27/022 , H01F5/003 , H01F27/2804 , H04N23/54 , H01F2027/2809
Abstract: A coil member according to an embodiment comprises: a substrate comprising a first surface and a second surface opposite to the first surface, and comprising a hole; a circuit pattern that is disposed on at least one of the first surface and the second surface and comprises a wiring pattern, a plating pattern, and a dummy pattern; and a protective layer that is disposed on the substrate and surrounds the circuit pattern, wherein the protective layer comprises a first protective layer disposed on the first surface and a second protective layer disposed on the second surface, the substrate comprises a first edge disposed on the outer edge of the substrate and a second edge surrounding the hole, and the substrate comprises a 1-1 region adjacent to the first edge, and a 1-2 region, wherein the 1-1 region is disposed between the first edge and the 1-2 region, a 1-1 protective layer is disposed on a first surface of the 1-1 region, a 1-2 protective layer is disposed on a first surface of the 1-2 region, and the thickness deviation of the 1-1 protective layer is 0.1 μm or less.
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公开(公告)号:US20230408839A1
公开(公告)日:2023-12-21
申请号:US18037625
申请日:2021-11-17
Applicant: LG INNOTEK CO., LTD.
Inventor: Sang Kyu LEE , Jung Hun OH , Chae Hwan YIM
CPC classification number: G02B27/646 , G03B5/00 , H01F17/0006 , G03B2205/0007 , G03B2205/0069
Abstract: A coil member, according to an embodiment, comprises: a substrate comprising a first surface and a second surface that is opposite to the first surface; a wiring pattern disposed on the substrate; and a metal coating pattern which is connected to the wiring pattern, the metal coating pattern being thinner than the wiring pattern.
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