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    ANTENNA MODULE
    2.
    发明公开
    ANTENNA MODULE 审中-公开

    公开(公告)号：US20240275073A1

    公开(公告)日：2024-08-15

    申请号：US18565596

    申请日：2022-05-31

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chan Woo YANG ,  Jeong Su PARK ,  Jung Hun OH

    IPC: H01Q21/28 ,  H01Q1/38 ,  H01Q5/25 ,  H01Q9/04

    CPC classification number: H01Q21/28 ,  H01Q1/38 ,  H01Q9/0485 ,  H01Q5/25

    Abstract: An antenna module according to an embodiment of the present invention comprises: a substrate that includes a ground portion and a dielectric portion; a first antenna that has a length corresponding to a first frequency band and is located on one side of a first edge of the substrate; a second antenna that has a length corresponding to a second frequency band and is located on one side of a second edge of the substrate; and a stub that is located on the one side of the first edge or the one side of the second edge so as to be between the first antenna and the second antenna. The stub is spaced a first distance from the first antenna and spaced a second distance from the second antenna, wherein the first distance and the second distance are set on the basis of a first wavelength band and a second wavelength band which correspond to the first frequency band and the second frequency band.

    LIGHT EMITTING DEVICE AND LIGHTING SYSTEM
    5.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHTING SYSTEM 有权
    发光装置和照明系统

    公开(公告)号：US20160181479A1

    公开(公告)日：2016-06-23

    申请号：US14978741

    申请日：2015-12-22

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Baek Jun KIM ,  Hiroshi KODAIRA ,  Ki Man KANG ,  Ha Na KIM ,  Hyun Don SONG ,  Jung Woo LEE ,  Jung Hun OH

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/58

    CPC classification number: H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2933/0058 ,  H01L2924/00014

    Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.

    Abstract translation: 一种发光器件包括具有空腔的腔体和围绕空腔的台阶差分结构，空腔中的多个电极，空腔中的发光芯片，具有设置在台阶差分结构上的外部部分的透明窗口以覆盖 空腔和透明窗与主体之间的粘合构件。 所述粘合部件包括在所述透明窗的外底表面和所述台阶差结构的底部之间的第一粘合构件，以及在所述透明窗的外部与所述主体之间的第二粘合构件。

    SEMICONDUCTOR ELEMENT PACKAGE AND LIGHT-EMITTING DEVICE COMPRISING SAME
    6.
    发明申请
    SEMICONDUCTOR ELEMENT PACKAGE AND LIGHT-EMITTING DEVICE COMPRISING SAME 有权

    公开(公告)号：US20210183836A1

    公开(公告)日：2021-06-17

    申请号：US17052631

    申请日：2019-05-03

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jung Hun OH

    IPC: H01L25/16 ,  H01L33/62

    Abstract: An embodiment discloses a semiconductor element package and a light-emitting device comprising same. The semiconductor element package comprises: a body comprising a cavity; a first electrode and a second electrode arranged on the bottom surface of the cavity; a semiconductor element arranged on the first electrode; a protective element arranged on the first electrode and spaced apart from the semiconductor element; a first wire electrically connecting the semiconductor element and the second electrode; and a second wire electrically connecting the protective element and the second electrode. The second electrode is arranged to be spaced apart from the first electrode in a first direction. The second electrode overlaps the semiconductor element in the first direction. The protective element is arranged to deviate from the semiconductor element in a second direction that is perpendicular to the first direction. The first electrode comprises a groove arranged between the semiconductor element and the protective element.

    SEMICONDUCTOR DEVICE
    7.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190273180A1

    公开(公告)日：2019-09-05

    申请号：US16309883

    申请日：2017-06-14

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jung Hun OH

    IPC: H01L33/14 ,  H01L33/38 ,  H01L33/40

    Abstract: Disclosed in an embodiment is a semiconductor device comprising: a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.

    SEMICONDUCTOR DEVICE PACKAGE AND LIGHT IRRADIATION DEVICE COMPRISING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND LIGHT IRRADIATION DEVICE COMPRISING THE SAME 有权

    公开(公告)号：US20210210655A1

    公开(公告)日：2021-07-08

    申请号：US17057497

    申请日：2019-04-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jung Hun OH ,  Ki Cheol KIM

    IPC: H01L33/20 ,  H01L33/58 ,  H01L33/40 ,  H01L33/62

    Abstract: An embodiment discloses a semiconductor device package comprising: a substrate; an electrode disposed on the substrate; a semiconductor device and a protective device which are disposed on the electrode; a dummy electrode disposed on the substrate and spaced apart from the electrode along the edge of the substrate; a reflective member disposed on the dummy electrode and having an outer surface, an inner surface surrounding the semiconductor device and forming a cavity, and a bottom surface facing the substrate; and a light-transmitting member disposed on the reflective member and covering the cavity, wherein the inner surface includes a first surface adjacent to the substrate and a second surface extending from the first surface to the light-transmitting member and having a parabolic shape, and the bottom surface of the reflective member has a first recess disposed on the protective device between the dummy electrode and the inner surface.

    SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190067507A1

    公开(公告)日：2019-02-28

    申请号：US16077261

    申请日：2017-02-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jung Hun OH ,  Hyung Jo PARK

    IPC: H01L31/075 ,  H01L31/105 ,  H01L33/10 ,  H01L33/38 ,  H01L33/46

    Abstract: A semiconductor device of an embodiment includes first and second semiconductor layers having different conductivity types; a third semiconductor layer interposed between the first and second semiconductor layers; and a fourth semiconductor layer interposed between the second and third semiconductor layers, having a lower doping concentration than that of the first semiconductor layer and the same conductivity type as the first semiconductor layer, wherein the difference in doping concentration between the first semiconductor layer and the fourth semiconductor layer may be greater than 4×E18 atoms/cm3.

    LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE
    10.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
    发光装置和发光装置包装

    公开(公告)号：US20160225951A1

    公开(公告)日：2016-08-04

    申请号：US15009562

    申请日：2016-01-28

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ki Man KANG ,  Jung Hun OH

    IPC: H01L33/14 ,  H01L33/24 ,  H01L33/30 ,  H01L33/38 ,  H01L33/06 ,  H01L33/32

    CPC classification number: H01L33/145 ,  H01L33/06 ,  H01L33/24 ,  H01L33/305 ,  H01L33/325 ,  H01L33/38 ,  H01L33/44

    Abstract: Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer and a second conductive semiconductor layer on the active layer; a first electrode pad on the first conductive semiconductor layer; a second electrode pad on the second conductive semiconductor layer; and a current blocking pattern overlapping an edge of at least one of the first and second electrode pads.

    Abstract translation: 公开了一种发光器件和发光器件封装。 发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层上的有源层和有源层上的第二导电半导体层; 在所述第一导电半导体层上的第一电极焊盘; 在所述第二导电半导体层上的第二电极焊盘; 以及与第一和第二电极焊盘中的至少一个的边缘重叠的电流阻挡图案。

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