公开(公告)号：US20240414842A1

公开(公告)日：2024-12-12

申请号：US18811400

申请日：2024-08-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20200243452A1

公开(公告)日：2020-07-30

申请号：US16756552

申请日：2018-10-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Hyung Kyu YOON ,  Sung Min CHAE

IPC: H01L23/538 ,  H01L23/498 ,  H01L25/16 ,  H01L25/18 ,  H01L23/00

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

公开(公告)号：US20180027651A1

公开(公告)日：2018-01-25

申请号：US15657296

申请日：2017-07-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/00 ,  H05K3/18 ,  H05K1/18 ,  H05K1/14 ,  H05K3/28 ,  H01L23/498 ,  H01L21/48

CPC classification number: H05K1/0281 ,  H01L21/481 ,  H01L21/4821 ,  H01L23/4985 ,  H01L24/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/15153 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/189 ,  H05K3/18 ,  H05K3/28 ,  H05K2201/055 ,  H05K2201/10128

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US20240006945A1

公开(公告)日：2024-01-04

申请号：US18255290

申请日：2022-01-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Jin LEE ,  Hyung Kyu YOON ,  Hye Yeong JUNG ,  Jung Hun OH

IPC: H02K3/26 ,  G03B5/02 ,  H01F27/28 ,  H02K3/44 ,  H02K41/035

CPC classification number: H02K3/26 ,  G03B5/02 ,  H01F27/2804 ,  H02K3/44 ,  H02K41/0354 ,  H02K2203/03

Abstract: A coil member according to an embodiment comprises: a substrate having a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; and a plurality of bridge portions protruding from an end of the substrate, wherein the bridge portions are integrally formed with the substrate, and a shield layer is disposed on the bridge portions.

公开(公告)号：US20230114245A1

公开(公告)日：2023-04-13

申请号：US17906161

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Kyu LEE ,  Hyung Kyu YOON ,  Seung Jin LEE

IPC: G03B5/04 ,  H02K3/26 ,  H02K41/035

Abstract: A coil substrate according to an embodiment includes an insulating layer; a first coil pattern portion disposed on one surface of the insulating layer; a second coil pattern portion disposed on the other surface of the insulating layer; and a pad portion disposed on the one surface of the insulating layer and connected to the first coil pattern portion, wherein the first coil pattern portion includes: an inner coil pattern portion; and an outer coil pattern portion spaced apart from the inner coil pattern portion at a predetermined interval and disposed outside the inner coil pattern portion, wherein the pad portion is disposed between the inner coil pattern portion and the outer coil pattern portion.

公开(公告)号：US20220071005A1

公开(公告)日：2022-03-03

申请号：US17523421

申请日：2021-11-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

IPC: H05K1/09 ,  H05K3/34 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20220294959A1

公开(公告)日：2022-09-15

申请号：US17634291

申请日：2020-07-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Jin LEE ,  Hyung Kyu YOON ,  Hye Yeong JUNG

IPC: H04N5/232 ,  H04N5/225 ,  G02B27/64

Abstract: A coil member according to an embodiment comprises: a substrate including an upper surface and a lower surface opposite to the upper surface; a first coil electrode disposed on the upper surface of the substrate and including first pattern electrodes; a second coil electrode disposed on the lower surface of the substrate and including second pattern electrodes; and third pattern electrodes disposed on the upper surface and the lower surface of the substrate, wherein a distance between the first pattern electrodes is different from a distance between the first pattern electrodes and the third pattern electrodes, and a distance between the second pattern electrodes is different from a distance between the second pattern electrodes and the third pattern electrodes.

公开(公告)号：US20210084755A1

公开(公告)日：2021-03-18

申请号：US17106039

申请日：2020-11-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

Abstract: A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.

公开(公告)号：US20210045229A1

公开(公告)日：2021-02-11

申请号：US16614192

申请日：2018-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Jong Seok PARK ,  Hyung Kyu YOON ,  Seong Hwan IM ,  Gi Uk YANG ,  Dae Sung YOO

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  H05K1/14

Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

公开(公告)号：US20230209705A1

公开(公告)日：2023-06-29

申请号：US18115218

申请日：2023-02-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

CPC classification number: H05K1/0281 ,  H01L23/4985 ,  H01L24/16 ,  H01L21/481 ,  H01L21/4821 ,  H05K1/144 ,  H05K3/28 ,  H05K3/18 ,  H05K1/0271 ,  H05K1/189

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.