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公开(公告)号：US12035626B2
公开(公告)日：2024-07-09
申请号：US17426737
申请日：2020-01-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Sung Chul Kim
IPC: H10N10/17 , H10N10/852
CPC classification number: H10N10/17 , H10N10/852
Abstract: A thermoelectric device of the present invention comprises a first substrate; first electrodes; a P-type thermoelectric leg; an N-type thermoelectric leg and an insulating leg; a second electrode; and a second substrate. The first and second electrodes comprises a plurality of electrodes, the insulating leg comprises a third plating layer, an insulating layer comprising a polymer resin, and a fourth plating layer. The modulus of elasticity of the insulating leg is 3 to 1000 MPa.
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公开(公告)号：US11723275B2
公开(公告)日：2023-08-08
申请号：US16782295
申请日：2020-02-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Sung Chul Kim
IPC: H01L35/32 , H10N10/17 , H10N10/817
CPC classification number: H10N10/17 , H10N10/817
Abstract: A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
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公开(公告)号：US20220093839A1
公开(公告)日：2022-03-24
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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Patent Agency Ranking
公开(公告)号：US11903312B2
公开(公告)日：2024-02-13
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US11205746B2
公开(公告)日：2021-12-21
申请号：US16615516
申请日：2018-06-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US12178129B2
公开(公告)日：2024-12-24
申请号：US16952533
申请日：2020-11-19
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Hoon Bong , Un Hak Lee , Sung Chul Kim
IPC: H10N10/17 , H10N10/13 , H10N10/817
Abstract: A power generating apparatus according to one embodiment of the present invention includes a duct through which a first fluid passes, a first thermoelectric module and a second thermoelectric module disposed on a first surface of the duct to be spaced apart from each other, a connector disposed between the first thermoelectric module and the second thermoelectric module on the first surface of the duct, and a shield member disposed on the connector on the first surface of the duct, wherein the shield member includes a first face and a second face having a height higher than a height of the first face.
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公开(公告)号：US11980098B2
公开(公告)日：2024-05-07
申请号：US17881179
申请日：2022-08-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Sung Chul Kim
Abstract: A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
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公开(公告)号：US11844278B2
公开(公告)日：2023-12-12
申请号：US17424574
申请日：2020-01-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Seung Hwan Lee , Se Woon Lee , In Seok Kang , Sung Chul Kim
IPC: H10N10/817 , H10N10/17 , H10N10/854 , H10N10/856
CPC classification number: H10N10/817 , H10N10/17 , H10N10/854 , H10N10/856
Abstract: A thermoelectric element of the present invention comprises a first metal substrate, a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes, a second resin layer, and a second metal substrate, wherein the first metal substrate is a low-temperature portion, the second metal substrate is a high-temperature portion, the second resin layer comprises a first layer and a second layer arranged on the first layer, the first and second layers include a silicon (Si)-based resin, and the bonding strength of the first resin layer is higher than the bonding strength of the second resin layer.
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