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公开(公告)号：US11980098B2
公开(公告)日：2024-05-07
申请号：US17881179
申请日：2022-08-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Sung Chul Kim
Abstract: A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
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公开(公告)号：US11980095B2
公开(公告)日：2024-05-07
申请号：US17041267
申请日：2019-04-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Un Hak Lee , Jong Hyun Kang , Young Sam Yoo , Tae Woong Kim
Abstract: A heat converter according to one embodiment of the present invention comprises: a plurality of unit modules respectively arranged in a first direction and a second direction that intersects the first direction; and a frame, which supports the plurality of unit modules, allows cooling water to flow in through one surface arranged in the first direction, and allows the cooling water to be discharged through the other surface arranged in the first direction, wherein each unit module includes: a cooling water passage chamber having first and second surfaces arranged to be spaced in the first direction, third and fourth surfaces arranged to be spaced in a third direction that intersects the first direction and the second direction, a fifth surface arranged to be spaced in the second direction such that cooing water flows therein, and a sixth surface from which cooling water is discharged; a first thermoelectric module arranged on the first surface; and a second thermoelectric module arranged on the second surface, the first thermoelectric module includes a plurality of group thermoelectric elements, each group thermoelectric element includes a plurality of thermoelectric elements, which have the same minimum spacing distance from the fourth surface in the third direction, and the plurality of thermoelectric elements in at least one group thermoelectric element of the plurality of group thermoelectric elements are electrically connected to each other.
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Patent Agency Ranking
公开(公告)号：US11903312B2
公开(公告)日：2024-02-13
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US11205746B2
公开(公告)日：2021-12-21
申请号：US16615516
申请日：2018-06-07
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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公开(公告)号：US11723275B2
公开(公告)日：2023-08-08
申请号：US16782295
申请日：2020-02-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Seong Jae Jeon , Sung Chul Kim
IPC: H01L35/32 , H10N10/17 , H10N10/817
CPC classification number: H10N10/17 , H10N10/817
Abstract: A thermoelectric module according to an exemplary embodiment includes a first metal substrate including a first through-hole, a first insulating layer disposed on the first metal substrate, a first electrode part disposed on the first insulating layer and including a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the first electrode part, a second electrode part disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs and including a plurality of second electrodes, a second insulating layer disposed on the second electrode part, and a second metal substrate disposed on the second insulating layer and including a second through-hole, wherein the first metal substrate includes an effective region in which the first electrode part is disposed and a peripheral region formed outside the effective region, the second metal substrate includes an effective region in which the second electrode part is disposed and a peripheral region formed outside the effective region, the first through-hole occupies a portion of the effective region of the first metal substrate, the second through-hole occupies a portion of the effective region of the second metal substrate, and the first through-hole and the second through-hole are formed at positions corresponding to each other.
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公开(公告)号：US11489100B2
公开(公告)日：2022-11-01
申请号：US16769092
申请日：2018-12-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Jong Hyun Kang , Seong Jae Jeon
IPC: H01L35/32 , H01L35/30 , H01L23/367
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a duct through which cooling fluid passes; a first thermoelectric module disposed on a first surface of the duct; a second thermoelectric module disposed on a second surface, which is disposed in parallel to the first surface, of the duct; and a gas guide member disposed above a third surface disposed between the first surface and the second surface of the duct so as to be spaced from the third surface, wherein the gas guide member includes one end thereof coming in contact with the first thermoelectric module, the other end thereof coming in contact with the second thermoelectric module, and an extended part for connecting the one end and the other end, and the gas guide member can have a form in which the distance thereof from the third surface gradually increases toward the center between the one end and the other end.
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公开(公告)号：US20220093839A1
公开(公告)日：2022-03-24
申请号：US17534866
申请日：2021-11-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak Lee , Sang Hoon Bong , Young Kil Song , Yun Sang Song , Jung Ho Kim , Seong Jae Jeon , Young Sam Yoo , Sung Chul Kim
Abstract: A heat conversion apparatus according to one embodiment of the present invention comprises: a pipe which includes a first flat surface and a second flat surface disposed parallel to the first surface, and through which air having a lower temperature than entered air is discharged; a plurality of thermoelectric elements that have heat-absorbing surfaces disposed in external sides of the respective first and second surfaces; a plurality of printed circuit boards (PCBs) that are electrically connected to the plurality of thermoelectric elements; and coolant passing members that are disposed on heat-radiating surfaces of the plurality of thermoelectric elements, wherein an external floor surface of the coolant passing member includes a plurality of first external floor surfaces having a first height and a plurality of second external floor surfaces having a second height that is different from the first height, the plurality of first external floor surfaces are in contact with the heat-radiating surfaces of the plurality of thermoelectric elements, and the plurality of PCBs are disposed in the plurality of second external floor surfaces.
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