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公开(公告)号：US20240292754A1
公开(公告)日：2024-08-29
申请号：US18572489
申请日：2022-06-22
Applicant: LG INNOTEK CO., LTD.
Inventor： Un Hak LEE
Abstract: A thermoelectric device according to an embodiment of the present invention comprises: a fluid flow part including one surface and the other surface spaced apart from the one surface in a first direction; a first thermoelectric element arranged on one surface of the fluid flow part; and a second thermoelectric element arranged on the other surface of the fluid flow part. A first groove overlapping the first thermoelectric element in the first direction and a first hole not overlapping the first thermoelectric element in the first direction are arranged on one surface of the fluid flow part, wherein a depth of the first groove is less than a distance between the one surface and the other surface thereof, and the first hole penetrates from the one surface to the other surface thereof.
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公开(公告)号：US12022734B2
公开(公告)日：2024-06-25
申请号：US17288979
申请日：2019-11-15
Applicant: KELK Ltd.
Inventor： Toshihiko Kishizawa , Shinichi Fujimoto
Abstract: A thermoelectric module includes a substrate, a plurality of electrodes arranged on a surface of the substrate, a plurality of thermoelectric elements respectively connected to the plurality of electrodes, and at least three terminals respectively connected to the different electrodes and connected to one or both of a first load and a second load.
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3.发明公开公开(公告)号：US20230413671A1
公开(公告)日：2023-12-21
申请号：US17874863
申请日：2022-07-27
Applicant: Purdue Research Foundation
Inventor： Kazuaki Yazawa , Na Lu , Yining Feng
IPC: H10N10/17 , H10N10/01 , H10N10/82 , H10N10/852
CPC classification number: H10N10/17 , H10N10/01 , H10N10/82 , H10N10/852
Abstract: A thin-film thermoelectric generator including flexible base film substrate having a longitudinal direction and a transverse direction perpendicular to the longitudinal direction. Thermoelectric (TE) elements are located on the base film substrate. The TE elements arranged in columns oriented along the longitudinal direction of the base film substrate and rows oriented along the transverse direction of the base film substrate. Line grooves are located between at least portion of the rows of the TE elements and extending across the base film substrate in the transverse direction to provide flexibility to the thin-film thermoelectric generator.
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4.发明授权公开(公告)号：US11849640B2
公开(公告)日：2023-12-19
申请号：US18073258
申请日：2022-12-01
Applicant: Tianma Japan, Ltd.
Inventor： Nobuya Seko
Abstract: Thermoelectric conversion cells of a thermoelectric conversion element include a thermoelectric conversion layer formed on a main surface of a substrate, an insulating layer covering the thermoelectric conversion layer, a first electrode including a first layer and a second layer, and a second electrode. The first layer connects to the main surface of the thermoelectric conversion layer via a first contact hole, and the second layer covers the first layer. The second electrode connects to the main surface of the thermoelectric conversion layer via a second contact hole. The second layer and the second electrode, and the first layer are formed from materials having different work functions. In thermoelectric conversion cells that are adjacent to each other, the second layer of one of the thermoelectric conversion cells and the second electrode of the other of the thermoelectric conversion cells are formed integrally, and the thermoelectric conversion cells are connected in series.
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5.发明公开公开(公告)号：US20230389426A1
公开(公告)日：2023-11-30
申请号：US18318612
申请日：2023-05-16
Applicant: STMicroelectronics S.r.l.
Inventor： Paolo FERRARI , Flavio Francesco VILLA , Marco DEL SARTO
Abstract: MEMS thermoelectric generator comprising: a thermoelectric cell including one or more thermoelectric elements partially extending on a cavity of the thermoelectric cell; a thermoplastic layer extending on the thermoelectric cell and having a top surface and a bottom surface opposite to each other along a first axis, the bottom surface facing the thermoelectric cell and the thermoplastic layer being of thermally insulating material and configured to be processed through laser direct structuring, LDS, technique; a heat sink configured to exchange heat with the thermoelectric cell interposed, along the first axis, between the heat sink and the thermoplastic layer; and a thermal via of metal material, extending through the thermoplastic layer from the top surface to the bottom surface so that it is superimposed, along the first axis, on the cavity, wherein the thermoelectric cell may exchange heat with a thermal source through the thermal via.
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Patent Agency Ranking
公开(公告)号：US20230189650A1
公开(公告)日：2023-06-15
申请号：US18163694
申请日：2023-02-02
Applicant: Industry-University Cooperation Foundation Hanyang University Erica Campus , Ajou University Industry-Academic Cooperation Foundation
Inventor： Tae Joo Park , Sang Woon Lee , Dae Woong Kim , Tae Jun Seok , Jae Hyun Yoon , Ji Hyeon Choi
IPC: H10N10/855 , H10N10/01 , H10N10/13 , H10N10/817 , H10N10/82 , H01L23/427
CPC classification number: H10N10/855 , H10N10/01 , H10N10/13 , H10N10/817 , H10N10/82 , H01L23/427
Abstract: Provided is a preparation method for a thermoelectric composite. The preparation method for a thermoelectric composite comprises the steps of: preparing a base substrate containing a first binary metal oxide; and providing a metal precursor and a reaction material containing oxygen (O) onto the base substrate to form a material film containing a second biliary metal oxide resulting from the reaction of the metal precursor and the reaction material, wherein in the step of forming the material film, a 2-dimensional electron gas is generated between the base substrate and the material film as the material film is formed on the base substrate.
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公开(公告)号：US11659767B2
公开(公告)日：2023-05-23
申请号：US16485729
申请日：2018-02-14
Inventor： Masahiro Ogawa , Tetsuya Kato , Takayuki Hachida
IPC: H10N10/17 , H10N10/82 , H10N10/817
CPC classification number: H10N10/17 , H10N10/817 , H10N10/82
Abstract: A thermoelectric element-containing package according to one aspect of the present disclosure includes a thermoelectric conversion module including: a first substrate having first and second main surfaces; a second substrate having third and fourth main surfaces; and a plurality of thermoelectric elements that are sandwiched between the first and second substrates and arranged along the second main surface and the third main surface. The thermoelectric element-containing package further includes: a frame joined to the first and second substrates so as to form a hermetically sealed space surrounding the plurality of thermoelectric elements and disposed between the first substrate and the second substrate; and a placement member that is disposed on the first main surface of the first substrate or the fourth main surface of the second substrate and to which an additional device is to be connected.
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公开(公告)号：US11658095B2
公开(公告)日：2023-05-23
申请号：US16370703
申请日：2019-03-29
Applicant: Intel Corporation
Inventor： Kelly Lofgreen , Chandra Mohan Jha , Krishna Vasanth Valavala
CPC classification number: H01L23/38 , H01L23/481 , H01L24/09 , H01L24/17 , H01L25/18 , H10N10/01 , H10N10/82 , H01L2924/1434
Abstract: An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.
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9.发明公开公开(公告)号：US20240334832A1
公开(公告)日：2024-10-03
申请号：US18574080
申请日：2022-02-25
Inventor： Kotaro HIROSE , Masahiro ADACHI , Tsunehiro TAKEUCHI
IPC: H10N10/817 , H10N10/01 , H10N10/82 , H10N10/851
CPC classification number: H10N10/817 , H10N10/01 , H10N10/82 , H10N10/8556
Abstract: A thermoelectric conversion element includes a first electrode, a thermoelectric conversion material portion configured to convert heat into electricity, an intermediate layer arranged on the thermoelectric conversion material portion, a conductive bonding material arranged in between the intermediate layer and the first electrode to bond the first electrode to the intermediate layer, and a second electrode connected to the thermoelectric conversion material portion. The intermediate layer includes a first layer arranged on the thermoelectric conversion material portion and containing a dopant, and a second layer arranged on the first layer and configured to suppress diffusion of elements. The intermediate layer has an interface resistivity of not less than 0.0001 mΩcm2 and not more than 0.5 mΩcm2.
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公开(公告)号：US12046894B2
公开(公告)日：2024-07-23
申请号：US17956924
申请日：2022-09-30
Applicant: ROLLS-ROYCE plc
Inventor： David R Trainer , Mark Sweet
Abstract: There is provided a current limiting diode 200 comprising a gate 206, a source 202, a drain 204 electrically connected to the source by an n-channel or p-channel 220 and a thermoelectric generator 208; wherein the source and the gate are electrically connected by a fill structure 210, and wherein the thermoelectric generator is configured to: generate a thermoelectric voltage by absorbing heat from the n-channel or p-channel and rejecting heat to a heat sink in a current limiting condition; and apply the thermoelectric voltage between the gate and the source.
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