公开(公告)号：US10734248B2

公开(公告)日：2020-08-04

申请号：US16662583

申请日：2019-10-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh Cho ,  Yoon Tai Kim

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US11876004B2

公开(公告)日：2024-01-16

申请号：US17660161

申请日：2022-04-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh Cho ,  Yoon Tai Kim

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49866 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US10347507B2

公开(公告)日：2019-07-09

申请号：US16146104

申请日：2018-09-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh Cho ,  Yoon Tai Kim

IPC: H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US09817497B2

公开(公告)日：2017-11-14

申请号：US14788836

申请日：2015-07-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Yoon Tai Kim ,  Hyung Mook Oh ,  Kweon Jin Lee ,  Soo Hong Kim

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112

Abstract: A touch window includes a substrate, and an electrode part on the substrate. The sensing electrode includes a base substrate formed with a pattern part, and an electrode layer on the pattern part, where the electrode layer has a thickness in a range of 0.03 μm to 3 μm.

公开(公告)号：US12234560B2

公开(公告)日：2025-02-25

申请号：US18234270

申请日：2023-08-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum Paik ,  Yoon Tai Kim

IPC: C25D7/06 ,  B32B15/01 ,  C23C14/04 ,  C23F1/02 ,  C23F1/28 ,  C25D5/12 ,  C25D5/50 ,  C23C14/12

Abstract: Discussed is a deposition mask including a metal plate. The metal plate includes an alloy of nickel (Ni) and iron (Fe) having a plurality of through-holes. Each of the through-holes includes a first surface hole, a second surface hole opposite to the first surface hole, and a connecting part through which the first surface hole and the second surface hole communicate with each other. The metal plate includes a first outer portion, a second outer portion opposite to the first outer portion and a central portion between the first outer portion and the second outer portion. Nickel contents of the first outer portion and the second outer portion are greater than that of the central portion.

公开(公告)号：US11781224B2

公开(公告)日：2023-10-10

申请号：US17542043

申请日：2021-12-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum Paik ,  Yoon Tai Kim

IPC: C23F1/28 ,  C23C14/04 ,  B32B15/01 ,  C23F1/02 ,  C25D5/50 ,  C25D7/06 ,  C25D5/12 ,  C23C14/12

CPC classification number: C23F1/28 ,  B32B15/015 ,  C23C14/042 ,  C23F1/02 ,  C25D5/12 ,  C25D5/50 ,  C25D7/0614 ,  C23C14/12

Abstract: Discussed is a deposition mask including a metal plate having a first surface and a second surface opposite to the first surface, wherein the metal plate including an invar, wherein the metal plate includes a plurality of through-hole, wherein the through-hole includes a first surface hole forming in the first surface, a second surface hole forming in the second surface, and a connecting part through which the first surface hole and the second surface hole communicate with each other, and wherein an angle formed by a virtual line connecting the end of the connecting part and the end of the second surface hole, and a virtual line extending in a direction parallel to the second face from the end of the second surface hole is 30 to 60 degrees.

公开(公告)号：US11476126B2

公开(公告)日：2022-10-18

申请号：US16952782

申请日：2020-11-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Oh Cho ,  Yoon Tai Kim

IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

公开(公告)号：US11293105B2

公开(公告)日：2022-04-05

申请号：US16492535

申请日：2018-03-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum Paik ,  Yoon Tai Kim

IPC: C23F1/28 ,  C25D7/06 ,  B32B15/01 ,  C23C14/04 ,  C23F1/02 ,  C25D5/50 ,  C25D5/12 ,  C23C14/12

Abstract: A metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate having a thickness of 30 μm or less and containing an alloy of nickel (Ni) and iron (Fe), and comprises: a first outer portion occupying an area corresponding to 20% or less of the total thickness of the metal plate from one surface thereof; a second outer portion occupying an area corresponding to 20% or less of the total thickness from the other surface opposite to the one surface; and a central portion except the first outer portion and the second outer portion, wherein the first outer portion and the second outer portion each have a larger nickel content than that of the central portion. The multilayer metal plate for use in manufacture of a deposition mask according to an embodiment is a multilayer metal plate containing an alloy of nickel (Ni) and iron (Fe), and is manufactured by a method comprising the steps of: forming a nickel-plated layer; forming an iron-plated layer on the nickel-plated layer; forming a multilayer-plated plate in which the nickel-plated layer and the iron-plated layer are alternately and repeatedly arranged; and heat-treating the multilayer-plated plate at a temperature of 300° C. or higher.