-
公开(公告)号：US11726294B2
公开(公告)日：2023-08-15
申请号：US17222321
申请日：2021-04-05
申请人： LG INNOTEK CO., LTD.
发明人： Eun Mi Kim , Young Don O
IPC分类号： G02B7/09 , G02B7/08 , G03B3/10 , H04N23/57 , H04N23/67 , H04N23/68 , G02B27/64 , G03B5/00 , G03B13/36 , H04N23/55 , H04N23/60
CPC分类号： G02B7/09 , G02B7/08 , G02B27/646 , G03B3/10 , G03B5/00 , G03B13/36 , H04N23/57 , H04N23/67 , H04N23/682 , H04N23/685 , H04N23/6812 , G03B2205/0007 , G03B2205/0069 , H04N23/55 , H04N23/60
摘要： An embodiment comprises: a housing a bobbin disposed inside the housing, and having a lens disposed thereon; a first coil disposed at the outer circumferential surface of the bobbin; a first magnet disposed at a size part of the housing in correspondence to the first coil; a first position sensor disposed in the bobbin, and including first and second input terminals and first and second output terminals; a circuit board including first and second terminals electrically connected to the first and second output terminals of the first position sensor; and a capacitor connected in parallel to the first and second terminals of the circuit board so as to remove noise from the output of the first position sensor.
-
公开(公告)号：US12075138B2
公开(公告)日：2024-08-27
申请号：US16981974
申请日：2019-03-18
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O
IPC分类号： H04N23/00 , G02B5/02 , H01L25/075 , H05K1/18
CPC分类号： H04N23/00 , G02B5/02 , H01L25/0753 , H05K1/18
摘要： An embodiment comprises: a substrate; a light emitting unit including a light emitting diode disposed on the substrate; a light receiving unit including a lens barrel and a sensor; a case housing the light emitting unit; a diffusing unit coupled to the case and disposed above the light emitting unit; a circuit substrate coupled to the substrate and the sensor; a first wire electrically connecting the light emitting unit and the substrate; and a second wire electrically connecting the substrate and the circuit substrate.
-
公开(公告)号：US10656374B2
公开(公告)日：2020-05-19
申请号：US15772378
申请日：2016-10-28
申请人： LG INNOTEK CO., LTD.
发明人： Eun Mi Kim , Young Don O
IPC分类号： G02B7/09 , G02B3/10 , H04N5/225 , H04N5/232 , G02B7/08 , G03B3/10 , G02B27/64 , G03B5/00 , G03B13/36
摘要： An embodiment comprises: a housing a bobbin disposed inside the housing, and having a lens disposed thereon; a first coil disposed at the outer circumferential surface of the bobbin; a first magnet disposed at a size part of the housing in correspondence to the first coil; a first position sensor disposed in the bobbin, and including first and second input terminals and first and second output terminals; a circuit board including first and second terminals electrically connected to the first and second output terminals of the first position sensor; and a capacitor connected in parallel to the first and second terminals of the circuit board so as to remove noise from the output of the first position sensor.
-
公开(公告)号：US11815735B2
公开(公告)日：2023-11-14
申请号：US17804996
申请日：2022-06-01
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O , Sang Yeon Han
摘要： The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
-
公开(公告)号：US20200348487A1
公开(公告)日：2020-11-05
申请号：US16934804
申请日：2020-07-21
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O , Sang Yeon HAN
摘要： The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
-
公开(公告)号：US20210223505A1
公开(公告)日：2021-07-22
申请号：US17222321
申请日：2021-04-05
申请人： LG INNOTEK CO., LTD.
发明人： Eun Mi Kim , Young Don O
摘要： An embodiment comprises: a housing a bobbin disposed inside the housing, and having a lens disposed thereon; a first coil disposed at the outer circumferential surface of the bobbin; a first magnet disposed at a size part of the housing in correspondence to the first coil; a first position sensor disposed in the bobbin, and including first and second input terminals and first and second output terminals; a circuit board including first and second terminals electrically connected to the first and second output terminals of the first position sensor; and a capacitor connected in parallel to the first and second terminals of the circuit board so as to remove noise from the output of the first position sensor.
-
公开(公告)号：US10761292B2
公开(公告)日：2020-09-01
申请号：US15740711
申请日：2016-06-24
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O , Sang Yeon Han
摘要： The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
-
公开(公告)号：US20180196219A1
公开(公告)日：2018-07-12
申请号：US15740711
申请日：2016-06-24
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O , Sang Yeon HAN
摘要： The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
-
公开(公告)号：US20230324647A1
公开(公告)日：2023-10-12
申请号：US18337727
申请日：2023-06-20
申请人： LG INNOTEK CO., LTD.
发明人： Eun Mi Kim , Young Don O
CPC分类号： G02B7/09 , G03B13/36 , G02B7/08 , H04N23/57 , H04N23/685 , H04N23/67 , H04N23/6812 , G03B3/10 , H04N23/682 , G02B27/646 , G03B5/00 , G03B2205/0069 , G03B2205/0007 , H04N23/60 , H04N23/55
摘要： An embodiment comprises: a housing a bobbin disposed inside the housing, and having a lens disposed thereon; a first coil disposed at the outer circumferential surface of the bobbin; a first magnet disposed at a size part of the housing in correspondence to the first coil; a first position sensor disposed in the bobbin, and including first and second input terminals and first and second output terminals; a circuit board including first and second terminals electrically connected to the first and second output terminals of the first position sensor; and a capacitor connected in parallel to the first and second terminals of the circuit board so as to remove noise from the output of the first position sensor.
-
公开(公告)号：US20220291476A1
公开(公告)日：2022-09-15
申请号：US17804996
申请日：2022-06-01
申请人： LG INNOTEK CO., LTD.
发明人： Young Don O , Sang Yeon HAN
摘要： The present embodiments relate to a dual camera module comprising: a first camera module including a first lens module and a first image sensor disposed below the first lens module; and a second camera module including a second lens module and a second image sensor disposed below the second lens module, wherein the second camera module has a wider angle of view than the first camera module, and the second image sensor is disposed at a position higher than the first image sensor.
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.016 秒)
