Printed circuit board
    1.
    发明授权

    公开(公告)号:US12144116B2

    公开(公告)日:2024-11-12

    申请号:US17770757

    申请日:2020-10-21

    Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

    PRINTED CIRCUIT BOARD
    2.
    发明申请

    公开(公告)号:US20250031312A1

    公开(公告)日:2025-01-23

    申请号:US18910822

    申请日:2024-10-09

    Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

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