公开(公告)号：US09923123B2

公开(公告)日：2018-03-20

申请号：US15303445

申请日：2015-03-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Jeong Han Kim ,  Jeung Ook Park ,  Sang In Yoon ,  Hyun Gu Im

IPC: H01L33/44 ,  H01L33/00 ,  H05K1/02 ,  H05K1/18 ,  H01L33/38 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/44 ,  H01L33/00 ,  H01L33/38 ,  H01L33/62 ,  H01L33/642 ,  H05K1/02 ,  H05K1/021 ,  H05K1/056 ,  H05K1/117 ,  H05K1/18 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2203/049

Abstract: A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.

公开(公告)号：US09048402B2

公开(公告)日：2015-06-02

申请号：US13905899

申请日：2013-05-30

Applicant: LG INNOTEK CO., LTD. ,  KUKDO CHEMICAL CO., LTD.

Inventor： Sung Bae Moon ,  Sang In Yoon ,  Jae Hun Jeong ,  Min Young Kim

IPC: H01L33/56 ,  H01L33/58 ,  C08L83/06 ,  C08G59/32 ,  C08G59/38 ,  C08G59/30 ,  C08L63/00 ,  C08G77/14

CPC classification number: H01L33/56 ,  C08G59/306 ,  C08G59/3245 ,  C08G59/38 ,  C08G77/14 ,  C08L63/00 ,  C08L83/06 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/0002 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and a silicon-containing alicyclic epoxy resin.

Abstract translation: 公开了环氧树脂组合物和发光装置。 环氧树脂组合物包括三嗪衍生物环氧树脂和含硅脂环族环氧树脂。

公开(公告)号：US09024347B2

公开(公告)日：2015-05-05

申请号：US13906029

申请日：2013-05-30

Applicant: LG Innotek Co., Ltd.

Inventor： Sung Bae Moon ,  Jae Hun Jeong ,  Sang In Yoon

IPC: H01L33/58 ,  H01L33/56 ,  C08G59/00 ,  C08G59/32 ,  C08G59/42 ,  C08L63/00 ,  C08L63/06

CPC classification number: H01L33/58 ,  C08G59/3218 ,  C08G59/3245 ,  C08G59/4215 ,  C08L63/06 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and an alicyclic epoxy resin.

Abstract translation: 公开了环氧树脂组合物和发光装置。 环氧树脂组合物包括三嗪衍生物环氧树脂和脂环族环氧树脂。

公开(公告)号：US09812618B2

公开(公告)日：2017-11-07

申请号：US14768108

申请日：2014-02-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jaehun Jeong ,  Sung Bae Moon ,  Sang In Yoon ,  Mi Jin Lee ,  Yuwon Lee

IPC: C08L83/04 ,  H01L33/00 ,  H01L33/56 ,  C08L63/06 ,  C08G59/32 ,  C08G59/30 ,  H01L33/54 ,  H01L33/62 ,  F21K9/20 ,  C08K5/3492 ,  C08G77/14

CPC classification number: H01L33/56 ,  C08G59/306 ,  C08G59/3281 ,  C08G77/14 ,  C08K5/34924 ,  C08K5/34926 ,  C08L63/06 ,  C08L83/04 ,  C08L2201/02 ,  F21K9/20 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  C08L83/06 ,  H01L2924/00014

Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

公开(公告)号：US09681532B2

公开(公告)日：2017-06-13

申请号：US14901485

申请日：2014-05-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang In Yoon ,  Eun Jin Kim ,  Jeung Ook Park ,  Hyun Gu Im

IPC: H05K1/02 ,  H01L33/64 ,  H05K1/05 ,  H05K3/38 ,  H01S5/024 ,  H05K3/32 ,  H01L33/62

CPC classification number: H05K1/0204 ,  H01L33/62 ,  H01L33/641 ,  H01S5/02469 ,  H05K1/053 ,  H05K3/321 ,  H05K3/388 ,  H05K2201/0323 ,  H05K2201/10106

Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

公开(公告)号：US09241399B2

公开(公告)日：2016-01-19

申请号：US14580491

申请日：2014-12-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang In Yoon ,  Jeong Han Kim ,  Jeung Ook Park ,  Hyun Gu Im

IPC: H05K1/02 ,  H01L33/62 ,  H05K1/09 ,  H05K1/05 ,  H05K3/24

CPC classification number: H05K1/0201 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H05K1/05 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/243 ,  H05K2201/0338 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.

Abstract translation: 根据本发明的实施例的印刷电路板包括：第一金属层，形成在第一金属层的一个表面上的第二金属层和形成在第一金属层的另一个表面上的第三金属层的基板; 形成在第二金属层上的绝缘层和形成在绝缘层上的电路图案。 构造成容纳发光元件封装的空腔形成在绝缘层中。 第一金属层的热导率大于第二金属层和第三金属层的热导率。

公开(公告)号：US20160005937A1

公开(公告)日：2016-01-07

申请号：US14768108

申请日：2014-02-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jaehun Jeong ,  Sung Bae Moon ,  Sang In Yoon ,  Mi Jin Lee ,  Yuwon Lee

IPC: H01L33/56 ,  F21K99/00 ,  H01L33/62 ,  C08L83/04 ,  H01L33/54

CPC classification number: H01L33/56 ,  C08G59/306 ,  C08G59/3281 ,  C08G77/14 ,  C08K5/34924 ,  C08K5/34926 ,  C08L63/06 ,  C08L83/04 ,  C08L2201/02 ,  F21K9/20 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  C08L83/06 ,  H01L2924/00014

Abstract: An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

Abstract translation: 根据本发明一个实施方案提供的环氧树脂组合物包括：三嗪衍生物环氧化合物; 包含环脂族环氧基和硅氧烷基的硅氧烷化合物; 和固化剂，其中相对于100重量份的硅氧烷化合物，环氧树脂组合物包含10〜70重量份的硅氧烷基，从而提供耐热性，耐光性和耐湿过度优异的组合物， 对硅树脂具有良好的剪切粘合性，并能够半固化。