公开(公告)号：US20160297179A1

公开(公告)日：2016-10-13

申请号：US15037536

申请日：2014-11-07

Applicant: LINTEC CORPORATION

Inventor： Junichi Nakamura ,  Kentaro Miyazaki ,  Naoki Taya

IPC: B32B27/08 ,  B32B27/30 ,  B32B27/32 ,  C09J7/02

CPC classification number: B32B27/08 ,  B29C48/21 ,  B29K2023/0633 ,  B29K2023/08 ,  B29K2105/0085 ,  B29L2007/008 ,  B32B7/02 ,  B32B7/06 ,  B32B7/12 ,  B32B25/08 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/325 ,  B32B27/36 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2270/00 ,  B32B2274/00 ,  B32B2307/51 ,  B32B2405/00 ,  B32B2457/14 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2400/226 ,  C09J2423/046 ,  C09J2433/006

Abstract: A base film (2) of a dicing sheet includes a cutting-fragment suppression layer (A) and an expandable layer (B) laminated on one main surface of the cutting-fragment suppression layer (A). The expandable layer (B) has a laminate structure of a plurality of resin-based sublayer, including a resin-based sublayer (B1) located nearest to the cutting-fragment suppression layer (A) and a resin-based sublayer (B2) that is at least one of other resin-based sublayers than the resin-based sublayer (B1). The resin-based sublayer (B1) comprises a linear polyethylene as a primary resin. The resin-based sublayer (B2) comprises an ethylene-(meth)acrylic acid series copolymer as a primary resin. The cutting-fragment suppression layer (A) comprises a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).

Abstract translation: 切割片的基膜（2）包括层叠在切割片抑制层（A）的一个主表面上的切割片抑制层（A）和可扩展层（B）。 可膨胀层（B）具有多个基于树脂的子层的叠层结构，其包括位于最靠近切割片抑制层（A）的树脂基子层（B1）和树脂基子层（B2），所述树脂基子层 是除树脂基子层（B1）以外的其它树脂系亚层中的至少一种。 树脂基亚层（B1）包含线性聚乙烯作为主要树脂。 基于树脂的亚层（B2）包含作为主要树脂的乙烯 - （甲基）丙烯酸系共聚物。 切割片抑制层（A）包括含有芳香族系列环和脂肪族系基环和非环状烯烃系树脂中的至少一种的热塑性树脂的含环树脂（a1） a2），其是除含环树脂（a1）以外的烯烃系热塑性树脂。