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1.
公开(公告)号:US20200335471A1
公开(公告)日:2020-10-22
申请号:US16851330
申请日:2020-04-17
Applicant: LINTEC Corporation
Inventor: Akiko UMEDA , Manabu MIYAWAKI , Hidekazu NAKAYAMA , Hiroki INOUE , Toshifumi IMURA
IPC: H01L23/00 , H01L33/62 , C09J183/04 , C08G77/388
Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position.Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2 (a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].
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2.
公开(公告)号:US20180355111A1
公开(公告)日:2018-12-13
申请号:US15780537
申请日:2016-12-21
Applicant: LINTEC CORPORATION
Inventor: Yutaka NANASHIMA , Hidekazu NAKAYAMA , Manabu MIYAWAKI , Mikihiro KASHIO
IPC: C08G77/24 , C08G77/06 , C09J183/08 , C09K3/10
CPC classification number: C08G77/24 , C08G77/06 , C08G77/385 , C08G77/70 , C08G2170/00 , C08K5/544 , C08L83/08 , C09J11/06 , C09J183/04 , C09J183/08 , C09K3/10 , C09K3/1018
Abstract: The invention is a curable composition comprising the following component (A) and component (B):Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1): R1—D—SiO3/2 (a-1) Component (B): a silane coupling agent having a nitrogen atom in its molecule, anda method for producing the curable composition, anda cured product obtained by curing the curable composition, anda method for using the curable composition as an adhesive for an optical element-fixing material, anda method for using the curable composition as a sealant for an optical element-fixing material, andan optical device obtained by using the curable composition as an adhesive or a sealant for an optical element-fixing material.One aspect of the curable composition according to one embodiment of the invention can provide a cured product excellent in adhesiveness and heat resistance and having a low refractive index.
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