公开(公告)号：US20220293554A1

公开(公告)日：2022-09-15

申请号：US17636211

申请日：2020-08-20

Applicant: LINTEC CORPORATION

Inventor： Isao ICHIKAWA ,  Hidekazu NAKAYAMA ,  Yosuke SATO

IPC: H01L23/00 ,  B22F7/08

Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.

公开(公告)号：US20200335471A1

公开(公告)日：2020-10-22

申请号：US16851330

申请日：2020-04-17

Applicant: LINTEC Corporation

Inventor： Akiko UMEDA ,  Manabu MIYAWAKI ,  Hidekazu NAKAYAMA ,  Hiroki INOUE ,  Toshifumi IMURA

IPC: H01L23/00 ,  H01L33/62 ,  C09J183/04 ,  C08G77/388

Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position.Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2   (a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].

公开(公告)号：US20200277515A1

公开(公告)日：2020-09-03

申请号：US16646546

申请日：2018-09-04

Applicant: LINTEC CORPORATION

Inventor： Isao ICHIKAWA ,  Hidekazu NAKAYAMA ,  Akinori SATO

IPC: C09J7/10 ,  C09J11/04 ,  H01L21/78 ,  H01L21/683 ,  H01L23/00

Abstract: The present invention provides a film-shaped firing material 1 including sinterable metal particles 10, and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a tensile elasticity of the film-shaped firing material at 60° C. is in a range of 4.0 to 10.0 MPa, and a breaking elongation thereof at 60° C. is 500% or greater; and a film-shaped firing material with a support sheet including the film-shaped firing material 1 which contains sinterable metal particles and a binder component, and a support sheet 2 which is provided on at least one side of the film-shaped firing material, in which an adhesive force (a2) of the film-shaped firing material to the support sheet is smaller than an adhesive force (a1) of the film-shaped firing material to a semiconductor wafer, the adhesive force (a1) is 0.1 N/25 mm or greater, and the adhesive force (a2) is in a range of 0.1 N/25 mm to 0.5 N/25 mm.

公开(公告)号：US20170267904A1

公开(公告)日：2017-09-21

申请号：US15506556

申请日：2015-08-21

Applicant: LINTEC CORPORATION

Inventor： Hidekazu NAKAYAMA ,  Masami MATSUI ,  Mikihiro KASHIO

IPC: C09J183/04 ,  H01L33/56 ,  H01L23/00 ,  C09J11/04 ,  C08K3/36

CPC classification number: C09J183/06 ,  C08G77/16 ,  C08G77/18 ,  C08K3/00 ,  C08K3/36 ,  C08K5/548 ,  C08K2201/005 ,  C08L83/04 ,  C08L83/06 ,  C09J11/04 ,  C09J11/06 ,  C09J183/04 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L24/29 ,  H01L24/32 ,  H01L33/56 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00

Abstract: The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1), R1SiO3/2  (a-1) wherein R1 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises a sulfur atom in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.

公开(公告)号：US20230018086A1

公开(公告)日：2023-01-19

申请号：US17777926

申请日：2020-11-20

Applicant: LINTEC Corporation

Inventor： Hidekazu NAKAYAMA ,  Isao ICHIKAWA ,  Yosuke SATO

IPC: H01L21/683 ,  C08K9/04 ,  C08K3/08 ,  C08K5/11 ,  B22F7/08 ,  B22F1/10 ,  H01L21/78

Abstract: The present invention relates to a film-shaped firing material (1) which contains: sinterable metal particles (10); a binder component (20) that is a solid at room temperature; and a liquid component (30) that is a liquid at room temperature, the liquid component having a boiling point from 300 to 450° C.

公开(公告)号：US20200376549A1

公开(公告)日：2020-12-03

申请号：US16608288

申请日：2018-03-15

Applicant: LINTEC CORPORATION

Inventor： Isao ICHIKAWA ,  Hidekazu NAKAYAMA

IPC: B22F3/10 ,  B22F5/00 ,  B22F7/04 ,  H01L23/00

Abstract: A film-shaped fired material of the present invention is a film-shaped fired material 1 which contains sinterable metal particles 10 and a binder component 20, in which a time (A1) after the start of a temperature increase, at which a negative gradient is the highest, in a thermogravimetric curve (TG curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere and a maximum peak time (B1) in a time range of 0 seconds to 2160 seconds after the start of a temperature increase in a differential thermal analysis curve (DTA curve) measured from 40° C. to 600° C. at a temperature-rising-rate of 10° C./min in an air atmosphere using alumina particles as a reference sample satisfy a relationship of “A1

公开(公告)号：US20190300710A1

公开(公告)日：2019-10-03

申请号：US15781558

申请日：2016-12-21

Applicant: LINTEC CORPORATION

Inventor： Hidekazu NAKAYAMA ,  Mikihiro KASHIO

IPC: C08L83/04 ,  C09J183/04 ,  C08K9/06 ,  C08K5/5435 ,  C08K5/544 ,  C08K3/22

Abstract: The invention is a curable composition comprising the following component (A), component (B) and component (C), Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following specific formula (a-1) R1SiO3/2  (a-1) Component (B): a particulate having an average primary particle diameter of 5 to 40 nm Component (C): a particulate having an average primary particle diameter of larger than 0.04 μm to 8 μm, and a method for producing the curable composition, and a cured product obtained by curing the curable composition, and a method for using the curable composition as an adhesive for an optical element-fixing material, and a method for using the curable composition as a sealant for an optical element-fixing material. One aspect of the curable composition according to the invention can provide a cured product excellent in adhesiveness, peeling resistance and heat resistance, and a curable composition excellent in workability in coating process.

公开(公告)号：US20170253782A1

公开(公告)日：2017-09-07

申请号：US15506669

申请日：2015-08-21

Applicant: LINTEC CORPORATION

Inventor： Hidekazu NAKAYAMA ,  Masami MATSUI ,  Mikihiro KASHIO

IPC: C09J183/04 ,  C08K5/5435 ,  C08K5/544 ,  H01L31/0203 ,  C09J11/04 ,  C09J11/06 ,  H01L33/56 ,  C08K3/36 ,  C08K5/548

Abstract: The present invention is: a curable composition comprising a component (A), a component (B), and a component (C), the curable composition comprising the component (A) and the component (B) in a mass ratio (component (A):component (B)) of 100:0.3 to 100:50, the component (A) being a curable polysilsesquioxane compound that comprises a repeating unit represented by a formula (a-1), R1SiO3/2  (a-1) wherein R1 is a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted aryl group, the component (B) being fine particles having an average primary particle size of 5 to 40 nm, and the component (C) being a silane coupling agent that comprises an acid anhydride structure in its molecule. This invention provides: a curable composition that produces a cured product that exhibits excellent adhesion, excellent delamination resistance, and excellent heat resistance, and exhibits excellent workability during the application step, a method for producing the same, a cured product obtained by curing the curable composition, a method for using the curable composition as an optical element-securing adhesive or an optical element sealing material, and an optical device.

公开(公告)号：US20200276645A1

公开(公告)日：2020-09-03

申请号：US16645916

申请日：2018-09-03

Applicant: LINTEC CORPORATION

Inventor： Isao ICHIKAWA ,  Hidekazu NAKAYAMA

IPC: B22F7/04 ,  B32B27/18 ,  B32B7/12 ,  B22F7/08 ,  H01L23/00

Abstract: A film-shaped firing material 1 is provided, including sinterable metal particles 10 and a binder component 20, in which a content of the sinterable metal particles 10 is in a range of 15% to 98% by mass, a content of the binder component 20 is in a range of 2% to 50% by mass, a shrinkage factor in a planar direction of the film-shaped firing material after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes is 10% or less with respect to the shrinkage factor before the firing, and a volume shrinkage factor thereof is in a range of 15% to 90% with respect to the volume shrinkage factor before the firing, and a contact ratio of the film-shaped firing material with an adherend after being pressurized and fired under conditions of a temperature of 350° C. and a pressure of 10 MPa for 3 minutes in a state in which the film-shaped firing material is in contact with the adherend is 90% or greater with respect to a contact area of the adherend.

公开(公告)号：US20200273596A1

公开(公告)日：2020-08-27

申请号：US16650225

申请日：2018-09-28

Applicant: LINTEC Corporation

Inventor： Takeshi MORI ,  Hidekazu NAKAYAMA ,  Isao ICHIKAWA ,  Yukiharu NOSE

IPC: H01B1/22 ,  H01L21/52

Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.