公开(公告)号：US20170213757A1

公开(公告)日：2017-07-27

申请号：US15514842

申请日：2015-09-28

Applicant: LINTEC CORPORATION

Inventor： Masatomo NAKAMURA ,  Shigeyuki YAMASHITA

IPC: H01L21/683 ,  B23K26/53 ,  H01L21/324 ,  H01L23/31 ,  H01L21/67 ,  H01L21/302 ,  C09J7/02 ,  H01L23/29

CPC classification number: H01L21/6836 ,  B23K26/53 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/302 ,  H01L21/324 ,  H01L21/6715 ,  H01L23/29 ,  H01L23/31 ,  H01L2221/68327

Abstract: A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t≦150 μm and (2) tA/t≧78% below.