公开(公告)号：US20170213757A1

公开(公告)日：2017-07-27

申请号：US15514842

申请日：2015-09-28

Applicant: LINTEC CORPORATION

Inventor： Masatomo NAKAMURA ,  Shigeyuki YAMASHITA

IPC: H01L21/683 ,  B23K26/53 ,  H01L21/324 ,  H01L23/31 ,  H01L21/67 ,  H01L21/302 ,  C09J7/02 ,  H01L23/29

CPC classification number: H01L21/6836 ,  B23K26/53 ,  C09J7/29 ,  C09J2201/122 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  H01L21/302 ,  H01L21/324 ,  H01L21/6715 ,  H01L23/29 ,  H01L23/31 ,  H01L2221/68327

Abstract: A base film for sheets for semiconductor wafer processing, comprising a resin layer (A) and a resin layer (B) laminated on one surface of the resin layer (A), wherein one surface of the base film for sheets for semiconductor wafer processing comprises a surface of the resin layer (B), the resin layer (A) contains a thermoplastic elastomer having a Vicat softening point of 50° C. or higher and 87° C. or lower, the resin layer (B) contains a thermoplastic elastomer having a Vicat softening point of 91° C. or higher and 220° C. or lower, and a thickness t of the base film for sheets for semiconductor wafer processing and a thickness tA of the resin layer (A) satisfy the Formulae (1) t≦150 μm and (2) tA/t≧78% below.

公开(公告)号：US20160211163A1

公开(公告)日：2016-07-21

申请号：US14914358

申请日：2014-08-29

Applicant: LINTEC CORPORATION

Inventor： Shigeyuki YAMASHITA ,  Akinori SATO

IPC: H01L21/683 ,  C09J7/02

CPC classification number: H01L21/6836 ,  C08K5/0025 ,  C08K5/0075 ,  C08L2312/06 ,  C09J7/385 ,  C09J9/02 ,  C09J133/14 ,  C09J2201/122 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/31 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386 ,  C09J133/08 ,  C08L33/14 ,  C08L75/16

Abstract: A semiconductor processing sheet, the sheet comprising a base material and a pressure sensitive adhesive layer laminated on at least one surface of the base material, the pressure sensitive adhesive layer being formed of a pressure sensitive adhesive composition, the pressure sensitive adhesive composition containing a polymer having a salt and an energy ray curable group and an energy ray curable pressure sensitive adhesive component (excluding the above polymer). The semiconductor processing sheet can suppress contamination of an adherent at the time of peeling after energy ray irradiation while exhibiting a sufficient antistatic property.

Abstract translation: 一种半导体处理片，所述片包括层压在所述基材的至少一个表面上的基材和压敏粘合剂层，所述压敏粘合剂层由压敏粘合剂组合物形成，所述压敏粘合剂组合物含有聚合物 具有盐和能量射线固化性基团和能量射线固化型压敏粘合剂成分（不包括上述聚合物）。 半导体处理片能够抑制能量射线照射后的剥离时的粘着剂的污染，同时具有足够的抗静电性。