公开(公告)号：US20220253664A1

公开(公告)日：2022-08-11

申请号：US17624698

申请日：2020-06-06

申请人： LINXENS HOLDING

发明人： Simon Vassal ,  Christophe Mathieu

IPC分类号： G06K19/077

摘要： Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.

公开(公告)号：US20220268724A1

公开(公告)日：2022-08-25

申请号：US17625232

申请日：2020-06-23

申请人： LINXENS HOLDING

发明人： Daniel Eric ,  François Germain ,  Simon Vassal

IPC分类号： G01N27/327 ,  G01N33/487

摘要： Process for producing bands for biological measurements on the basis of flexible circuits on a carrier strip, provided with a flexible insulating substrate provided, on at least one of its faces, with conductive tracks, contact pads and electrodes, includes the application, to said face, of masking means leaving the contact pads and/or the electrodes of the band visible and the selective deposition of a layer of noble metal on said contact pads and electrodes through said masking means.

公开(公告)号：US20230281421A1

公开(公告)日：2023-09-07

申请号：US17926739

申请日：2021-05-20

申请人： Linxens Holding

发明人： Simon Vassal ,  Catheline RAMSAMY ,  Francois GREMION ,  Nicolas MICHAUDET

IPC分类号： G06K19/077 ,  H01L23/498 ,  H01L23/14 ,  H01L21/48

CPC分类号： G06K19/07739 ,  H01L23/49855 ,  G06K19/07747 ,  H01L23/49838 ,  H01L23/142 ,  H01L21/4846

摘要： The invention relates to an electrical circuit, for example of the printed circuit type, for producing a module intended to be integrated into a chip card. This module has electrical contact—or connector—areas for the connection and communication of the chip to and with a read/write system. In order to give them a different colour from the gilded or silvered ones generally used, these electrical contact areas are at least partially covered with a surface layer comprising a compound of XpOqNrCs type, in which X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, with p, q>0 and r≥0 and/or s≥0. The invention also relates to a method for manufacturing such an electrical circuit.

公开(公告)号：US11681893B2

公开(公告)日：2023-06-20

申请号：US17624698

申请日：2020-06-12

申请人： LINXENS HOLDING

发明人： Simon Vassal ,  Christophe Mathieu

IPC分类号： G06K19/077

CPC分类号： G06K19/07762

摘要： Disclosed is an electronic card, in the form of a flexible smart card provided with a flexible circuit, that includes a bottom face receiving electronic components and a top face provided with contact tabs intended to be connected to conductive tracks of a garment textile. The flexible circuit being covered on its bottom face with at least one bottom layer of bonding adhesive, first polymer layers provided with cutouts for receiving components and second polymer layers for encapsulating the components, and covered on its top face with a top layer of bonding adhesive and at least one top layer forming an outer face of the card made from polymer material provided with cutouts for accessing the contact tabs, in which at least some of the contact tabs are produced on the rim of the card and provided with an end part on the edge of the card.