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公开(公告)号:US09470409B2
公开(公告)日:2016-10-18
申请号:US14521991
申请日:2014-10-23
IPC分类号: F21V29/71 , F21V29/503 , F21V29/89 , F21K99/00 , F21V17/10 , F21V23/00 , F21V3/02 , F21V19/00 , F21Y101/02
CPC分类号: F21V29/71 , F21K9/23 , F21K9/238 , F21V3/02 , F21V17/108 , F21V19/0055 , F21V23/006 , F21V23/009 , F21V29/503 , F21V29/89 , F21Y2101/00 , F21Y2115/10
摘要: A light-emitting device comprising a heat dissipation carrier, a circuit board, a light-emitting element, a side heat conduction plate, an insulation shell and a light cover is provided. The circuit board is disposed on the heat dissipation carrier. The light-emitting element is disposed on the circuit board. The light cover is directly engaged with the heat dissipation carrier. The side heat conduction plate is engaged with the heat dissipation carrier and comprises a transverse plate and a side plate. The transverse plate carries the circuit board. The side plate is connected with the transverse plate. The insulation shell covers the side plate of the side heat conduction plate.
摘要翻译: 提供一种包括散热载体,电路板,发光元件,侧导热板,绝缘壳和灯罩的发光装置。 电路板设置在散热载体上。 发光元件设置在电路板上。 灯罩直接与散热托架接合。 侧导热板与散热载体接合,并包括横板和侧板。 横板承载电路板。 侧板与横板连接。 绝缘壳覆盖侧导热板的侧板。