公开(公告)号：US20200084893A1

公开(公告)日：2020-03-12

申请号：US16563527

申请日：2019-09-06

申请人： Lumileds Holding B.V.

发明人： Matthias EPMEIER ,  Petra WELLMEIER ,  Frank GIESE ,  Carsten WEBER ,  Michael DECKERS ,  Georg HENNINGER

IPC分类号： H05K3/12 ,  H05K3/32 ,  H05K3/34

摘要： A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

公开(公告)号：US20200152613A1

公开(公告)日：2020-05-14

申请号：US16681144

申请日：2019-11-12

申请人： LUMILEDS HOLDING B.V.

发明人： Michael DECKERS

IPC分类号： H01L25/075 ,  H01L23/538 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16 ,  H01L23/498 ,  F21S41/20 ,  H01L21/48 ,  H01L33/64 ,  F21S41/153 ,  F21S45/47

摘要： The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

公开(公告)号：US20200084889A1

公开(公告)日：2020-03-12

申请号：US16563516

申请日：2019-09-06

申请人： LUMILEDS HOLDING B.V.

发明人： Matthias EPMEIER ,  Michael DECKERS ,  Frank GIESE ,  Petra WELLMEIER ,  Carsten WEBER ,  Georg HENNINGER

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K1/18 ,  F21S41/151 ,  F21S41/19

摘要： A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.