公开(公告)号：US20240339386A1

公开(公告)日：2024-10-10

申请号：US18409912

申请日：2024-01-11

申请人： LX SEMICON CO., LTD.

发明人： Dongwoo MOON ,  Deogsoo KIM ,  Taeryong KIM

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L25/07

CPC分类号： H01L23/49811 ,  H01L21/561 ,  H01L23/3121 ,  H01L25/072 ,  H01L25/50

摘要： The embodiment relates to a power semiconductor module and a power converter including the same. A power semiconductor module according to an embodiment can include a first substrate and a second substrate, a power semiconductor sub-module disposed between the first substrate and the second substrate and a first lead frame and a second lead frame electrically connected to the power semiconductor sub-module. The power semiconductor sub-module can include a power semiconductor device disposed between a first internal lead frame and a second internal lead frame and an internal mold disposed between the first internal lead frame and the second internal lead frame, and disposed on a side surface of the power semiconductor device.