公开(公告)号：US20230320049A1

公开(公告)日：2023-10-05

申请号：US18207259

申请日：2023-06-08

Applicant: Laird Technologies, Inc.

Inventor： Hoang Dinh DO ,  Robert Howard BOUTIER, JR. ,  Jason L. STRADER ,  Michael S. PLANTE

IPC: H05K9/00 ,  C09K5/14

CPC classification number: H05K9/0081 ,  H05K9/0083 ,  C09K5/14

Abstract: According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.