公开(公告)号：US20190013291A1

公开(公告)日：2019-01-10

申请号：US16114687

申请日：2018-08-28

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Michael S. WLADYKA ,  Keith David JOHNSON ,  Jingting YANG ,  Kevin Joel BOHRER ,  Mark D. KITTEL

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367 ,  B32B37/00 ,  B32B38/00 ,  B32B38/06

Abstract: Disclosed are exemplary embodiments of systems and methods of applying materials to components. The materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

公开(公告)号：US20210028142A1

公开(公告)日：2021-01-28

申请号：US16988919

申请日：2020-08-10

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  Michael S. WLADYKA ,  Keith David JOHNSON ,  Jingting YANG ,  Kevin Joel BOHRER ,  Mark D. KITTEL

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/373 ,  H01L23/367 ,  B32B38/00 ,  B32B38/06 ,  B32B37/00 ,  H01L21/48 ,  H01L21/67

Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.