公开(公告)号：US20230049157A1

公开(公告)日：2023-02-16

申请号：US17795518

申请日：2021-01-26

Applicant: Lam Research Corporation

Inventor： Kapil Umesh Sawlani ,  Michal Danek ,  Ravi Vellanki ,  Sanjay Gopinath ,  David g. Cohen ,  Sassan Roham ,  Saravanapriyan Sriraman ,  Benjamin Allen Haskell ,  Lee j. Brogan

IPC: G05B19/418 ,  G05B13/02

Abstract: Methods, systems, and computer programs are presented for predicting the performance of semiconductor manufacturing equipment operations. One method includes an operation for obtaining machine-learning (ML) models, each model related to predicting a performance metric for an operation of a semiconductor manufacturing tool. Further, each ML model utilizes features defining inputs for the ML model. The method further includes an operation for receiving a process definition for manufacturing a product with the semiconductor manufacturing tool. One or more ML models are utilized to estimate a performance of the process definition used in the semiconductor manufacturing tool. Additionally, the method includes presenting, on a display, results showing the estimate of the performance of the manufacturing of the product. In some aspects, the use of hybrid models improves the predictive accuracy of the system by augmenting the capabilities of data-driven models with the reinforcement provided by the physics-based models.

公开(公告)号：US20240410760A1

公开(公告)日：2024-12-12

申请号：US18701900

申请日：2022-10-27

Applicant: Lam Research Corporation

Inventor： Karl Frederick Leeser ,  Michal Danek ,  Benjamin Allen Haskell ,  Kapu Sirish Reddy ,  Paul Franzen ,  Yukinori Sakiyama ,  Kapil Sawlani

IPC: G01J5/48 ,  C23C16/02 ,  C23C16/455 ,  C23C16/458 ,  C23C16/50 ,  C23C16/52 ,  G01J5/00 ,  G01J5/08 ,  G01M3/38 ,  G06T7/00 ,  G06T7/13 ,  H04N23/23

Abstract: Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.

公开(公告)号：US20240234112A1

公开(公告)日：2024-07-11

申请号：US18572075

申请日：2022-07-01

Applicant: Lam Research Corporation

Inventor： Michal Danek ,  Benjamin Allen Haskell ,  Kapu Sirish Reddy ,  David Badt ,  Brian Joseph Williams ,  Paul Franzen ,  Karl Frederick Leeser ,  Jennifer Leigh Petraglia ,  Yukinori Sakiyama ,  Kapil Sawlani

IPC: H01J37/32 ,  G06T7/00 ,  H01L21/67

CPC classification number: H01J37/32972 ,  G06T7/0004 ,  H01J37/32926 ,  H01J37/32981 ,  H01J37/3299 ,  H01L21/67248 ,  H01L21/67253 ,  H01J37/32944 ,  H01J2237/221 ,  H01J2237/3321 ,  H01J2237/3341

Abstract: Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.