公开(公告)号：US10903070B2

公开(公告)日：2021-01-26

申请号：US16147061

申请日：2018-09-28

Applicant: Lam Research Corporation

Inventor： Chanyuan Liu ,  Fayaz A. Shaikh ,  Niraj Rana ,  Nick Ray Linebarger, Jr.

IPC: H01L21/02 ,  H01L23/00 ,  H01L21/67 ,  H01L21/68 ,  H01J37/32 ,  C23C16/455 ,  C23C16/34 ,  C23C16/40 ,  C23C16/52

Abstract: Methods for reducing warpage of bowed semiconductor substrates, particularly saddle-shaped bowed semiconductor substrates, are provided herein. Methods involve depositing a bow compensation layer by plasma enhanced chemical vapor deposition on the backside of the bowed semiconductor substrate by region, such as by quadrants, to form a compressive film on a tensile substrate and a tensile film on a compressive substrate. Methods involve flowing different gases from different nozzles on a surface of a showerhead to deliver various gases by region in a one-step operation or flowing gases in a multi-step process by shielding regions of the showerhead during delivery of gases to deliver specific gases from non-shielded regions onto regions of the bowed semiconductor substrate by alternating between rotating the semiconductor substrate and flowing gases to the backside of the bowed semiconductor substrate.

公开(公告)号：US20220406578A1

公开(公告)日：2022-12-22

申请号：US17756081

申请日：2020-11-18

Applicant: Lam Research Corporation

Inventor： Yukinori Sakiyama ,  Niraj Rana ,  Noah Elliot Baker

IPC: H01J37/32 ,  H01J37/244 ,  H01L21/67 ,  G01J3/02 ,  G01J3/443 ,  C23C16/50 ,  C23C16/52

Abstract: An apparatus to determine occurrence of an anomalous plasma event occurring at or near a process station of a multi-station integrated circuit fabrication chamber is disclosed. In particular embodiments, optical emissions generated responsive to the anomalous plasma event may be detected by at least one photosensor of a plurality of photosensors. A processor may cooperate with the plurality of photosensors to determine that the anomalous plasma event has occurred at or near by a particular process station of the multi-station integrated circuit fabrication chamber.