公开(公告)号：US20070126088A1

公开(公告)日：2007-06-07

申请号：US11295371

申请日：2005-12-05

申请人： Lawrence Frazee ,  Wayne Lamb ,  John Patin ,  Peter Schelonka ,  Joel Stolfus

发明人： Lawrence Frazee ,  Wayne Lamb ,  John Patin ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  G01D11/245 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

摘要翻译： 传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。 还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器 包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

公开(公告)号：US20060283232A1

公开(公告)日：2006-12-21

申请号：US11155203

申请日：2005-06-15

申请人： Wayne Lamb ,  Lawrence Frazee ,  Peter Schelonka ,  Joel Stolfus

发明人： Wayne Lamb ,  Lawrence Frazee ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： G01P21/02

CPC分类号： G01D11/245 ,  F02B39/16 ,  F05B2220/40 ,  G01D5/147 ,  G01P1/026 ,  G01P3/488 ,  Y10T29/4978

摘要： A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

摘要翻译： 一种用于定向和校准用于速度传感器的磁体的方法和系统。 可以将磁体映射到其两个或更多个平面，以便相对于保持在速度传感器壳体内的一个或多个磁阻元件精确地定位磁体。 然后可以响应于磁体的映射来识别磁体相对于磁阻元件和传感器外壳的光学位置。 此后，可以将磁体接合到速度传感器壳体，以便实现由速度传感器壳体保持的用于速度检测操作的速度传感器。

公开(公告)号：US20070139044A1

公开(公告)日：2007-06-21

申请号：US11314328

申请日：2005-12-20

申请人： Wayne Lamb ,  Scott Michelhaugh ,  Peter Schelonka ,  Joel Stolfus

发明人： Wayne Lamb ,  Scott Michelhaugh ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： G01B7/30

CPC分类号： G01P1/026 ,  G01D11/245 ,  H05K3/202 ,  Y10T29/53052

摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

摘要翻译： 传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。 还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器 包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂和/或焊料以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

公开(公告)号：US20050017709A1

公开(公告)日：2005-01-27

申请号：US10627420

申请日：2003-07-25

申请人： Joel Stolfus ,  Nicholas Busch

发明人： Joel Stolfus ,  Nicholas Busch

IPC分类号： F01D17/06 ,  F01D21/00 ,  G01P3/488 ,  G01P3/49 ,  G01P3/46

CPC分类号： G01P3/49 ,  F01D17/06 ,  F01D21/003 ,  F05D2220/40 ,  F05D2270/304 ,  G01P3/488

摘要： A turbocharger includes a cylindrical wall and a non-ferromagnetic compressor wheel within the cylindrical wall. The non-ferromagnetic compressor wheel has fins. A magnetoresistive sensor housing is threaded through the cylindrical wall and houses a permanent magnet and at least one magnetoresistor. The permanent magnet is positioned so as to induce eddy currents on the fins. The permanent magnet magnetically biases the magnetoresistor, and the magnetoresistor senses rotation of the non-ferromagnetic compressor wheel.

摘要翻译： 涡轮增压器包括在圆柱形壁内的圆柱形壁和非铁磁性压缩机叶轮。 非铁磁压缩机叶轮具有翅片。 磁阻传感器壳体穿过圆柱形壁并容纳永磁体和至少一个磁电阻器。 定位永磁体以便在翅片上引起涡流。 永磁体对磁敏电阻进行磁偏置，并且磁电阻感测非铁磁压缩机叶轮的旋转。