公开(公告)号：US20070139044A1

公开(公告)日：2007-06-21

申请号：US11314328

申请日：2005-12-20

申请人： Wayne Lamb ,  Scott Michelhaugh ,  Peter Schelonka ,  Joel Stolfus

发明人： Wayne Lamb ,  Scott Michelhaugh ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： G01B7/30

CPC分类号： G01P1/026 ,  G01D11/245 ,  H05K3/202 ,  Y10T29/53052

摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

摘要翻译： 传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。 还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器 包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂和/或焊料以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

公开(公告)号：US20060283232A1

公开(公告)日：2006-12-21

申请号：US11155203

申请日：2005-06-15

申请人： Wayne Lamb ,  Lawrence Frazee ,  Peter Schelonka ,  Joel Stolfus

发明人： Wayne Lamb ,  Lawrence Frazee ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： G01P21/02

CPC分类号： G01D11/245 ,  F02B39/16 ,  F05B2220/40 ,  G01D5/147 ,  G01P1/026 ,  G01P3/488 ,  Y10T29/4978

摘要： A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

摘要翻译： 一种用于定向和校准用于速度传感器的磁体的方法和系统。 可以将磁体映射到其两个或更多个平面，以便相对于保持在速度传感器壳体内的一个或多个磁阻元件精确地定位磁体。 然后可以响应于磁体的映射来识别磁体相对于磁阻元件和传感器外壳的光学位置。 此后，可以将磁体接合到速度传感器壳体，以便实现由速度传感器壳体保持的用于速度检测操作的速度传感器。

公开(公告)号：US20070126088A1

公开(公告)日：2007-06-07

申请号：US11295371

申请日：2005-12-05

申请人： Lawrence Frazee ,  Wayne Lamb ,  John Patin ,  Peter Schelonka ,  Joel Stolfus

发明人： Lawrence Frazee ,  Wayne Lamb ,  John Patin ,  Peter Schelonka ,  Joel Stolfus

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  G01D11/245 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014

摘要： A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.

摘要翻译： 传感器封装装置包括支撑一个或多个电气部件的引线框架基板，其连接到并位于引线框架基板上。 还提供了多个引线键合，其将电气部件电连接到引线框架基板，其中引线框架基板由热固性塑料封装以保护多个引线接合和至少一个电气部件，从而提供传感器 包括引线框架基板，电气部件和引线接合的封装装置，同时不需要印刷电路板（PCB）或陶瓷基板代替引线框架基板作为传感器封装的一部分 仪器。 还可以提供导电环氧树脂以保持电气部件与引线框架基板的连接。 电气部件可以构成例如IC芯片和/或感测元件（例如，磁阻部件）或感测芯片。

公开(公告)号：US20060038559A1

公开(公告)日：2006-02-23

申请号：US11045667

申请日：2005-01-28

申请人： Wayne Lamb ,  Curtis Johnson

发明人： Wayne Lamb ,  Curtis Johnson

IPC分类号： G01N27/82

CPC分类号： B82Y25/00 ,  G01N27/9033 ,  G01R33/093

摘要： Eddy currents arise when a conductive material moves through a magnetic field. Eddy currents, like all electric currents, generate a magnetic field. The generated magnetic field can be detected and measured through use of one or more magnetically biased GMR elements. In general, an eddy current sensor can be configured, which includes a magnet, and a first giant magnetoresistive element placed such that the magnetic field from the magnet biases the giant magnetoresistive element along its primary axis.

摘要翻译： 导电材料通过磁场移动时会产生涡流。 像所有电流一样，涡流产生磁场。 可以通过使用一个或多个磁偏置GMR元件来检测和测量产生的磁场。 通常，可以构造涡流传感器，其包括磁体和放置为使得来自磁体的磁场沿着其主轴偏压巨磁阻元件的第一巨磁阻元件。

公开(公告)号：US20060006864A1

公开(公告)日：2006-01-12

申请号：US10940091

申请日：2004-09-14

申请人： Curtis Johnson ,  Gregory Furlong ,  Wayne Lamb ,  Wayne Kilian

发明人： Curtis Johnson ,  Gregory Furlong ,  Wayne Lamb ,  Wayne Kilian

IPC分类号： G01R33/02

CPC分类号： G01P13/04 ,  G01D5/145 ,  G01D5/2451 ,  G01P3/487

摘要： An integrated circuit magnetoresistive speed and direction sensor generally utilizes an AMR bridge circuit thereby allowing for increased air gap performance as compared to conventional Hall-effect element based sensors. The AMR sensor is capable of sensing ring magnets or bar magnets magnetized with one or more magnet poles along the desired travel. The number of poles of the magnet should be optimized based upon the application design. In order to obtain speed and direction information, two bridge circuits can be placed within proximity (I.e., the exact location and shape of the bridge can be determined based upon the target and desired performance) of each other. The signals of the two bridge circuits can be compared on integrated electronics. The bridges are generally rotated 45 degrees to reduce and/or eliminate offsets, which provide the sensor with a large air gap performance.

摘要翻译： 与传统的基于霍尔效应元件的传感器相比，集成电路磁阻速度和方向传感器通常利用AMR桥式电路，从而允许增加气隙性能。 AMR传感器能够沿着所需的行程感应环形磁铁或磁铁磁棒磁棒。 应根据应用设计优化磁体的极数。 为了获得速度和方向信息，可以将两个桥接电路放置在邻近处（即，可以基于目标和期望的性能来确定桥的确切位置和形状）。 可以在集成电路上比较两个桥接电路的信号。 桥通常旋转45度以减少和/或消除偏移，这为传感器提供了大的气隙性能。

公开(公告)号：US20060020436A1

公开(公告)日：2006-01-26

申请号：US10955313

申请日：2004-09-30

申请人： Kenneth Bechtold ,  Wayne Lamb

发明人： Kenneth Bechtold ,  Wayne Lamb

IPC分类号： G06G7/48

CPC分类号： F16D43/16 ,  F16D2250/00

摘要： A methodology and system for balancing a centrifugal clutch can be implemented that includes a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof. A mass center of the centrifugal clutch assembly can be calculated, and a distance from the axis of rotation of the centrifugal clutch assembly can be determined. Thereafter, associated part features of the centrifugal clutch assembly can be modified in order to move the mass center; and repeating as necessary establishing a 3-dimensional model of a centrifugal clutch assembly in an engaged position thereof, calculating a mass center of the centrifugal clutch assembly, determining a particular distance from an axis of rotation of the centrifugal clutch assembly, and modifying part features of the centrifugal clutch assembly in order to move the mass center in order to verify the axis of rotation and thereby balance the centrifugal clutch assembly.

摘要翻译： 可以实现用于平衡离心式离合器的方法和系统，其包括处于其接合位置的离心式离合器组件的三维模型。 可以计算离心式离合器组件的质量中心，并且可以确定离心离合器组件的旋转轴线的距离。 此后，可以改变离心式离合器组件的相关部件特征以移动质心; 并根据需要重复地建立其离合离合器组件的接合位置的三维模型，计算离心离合器组件的质量中心，确定离心离合器组件的旋转轴线的特定距离，以及修改部件特征 以便移动质心，以便验证旋转轴线，从而平衡离心离合器组件。