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公开(公告)号：US20240173677A1
公开(公告)日：2024-05-30
申请号：US18071363
申请日：2022-11-29
发明人： Eric B. Duoss , Megan Ellis , Sarah E. Baker , Nikola Dudukovic , Auston Louis Clemens , James Spencer Oakdale
CPC分类号： B01D67/00045 , B01D71/401 , B33Y10/00 , B33Y70/00 , B33Y80/00 , B01D2323/40 , B01D2325/04 , B01D2325/16 , B01D2325/42 , B01J41/09
摘要： A mixture for forming an anion exchange membrane includes a rigid monomer, an active monomer, and a polymerization initiator. The active monomer includes an acrylate group and a functional group selected from the following: a cation group, a halide group configured to be substituted with a cation group, or a leaving group configured to be substituted with a cation group.
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2.发明授权公开(公告)号：US10781315B2
公开(公告)日：2020-09-22
申请号：US15367069
申请日：2016-12-01
IPC分类号： C09D4/00 , C07C51/60 , B33Y70/00 , C08F222/18 , C07C231/02 , C07C231/12 , B33Y10/00 , B33Y80/00
摘要： According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.
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3.发明申请公开(公告)号：US20200377736A1
公开(公告)日：2020-12-03
申请号：US16995593
申请日：2020-08-17
IPC分类号： C09D4/00 , C07C51/60 , C07C231/02 , C07C231/12 , B33Y70/00 , B33Y10/00 , B33Y80/00 , C08F222/18
摘要： A resist blend for additive manufacturing includes a radiopaque pre-polymer compound, a photoinitiator, a polymerization inhibitor, and a base pre-polymer. The radiopaque pre-polymer compound includes at least one of the following elements: iodine, bromine, tin, lead, or bismuth. The resist blend is configured to have a first portion of the resist blend to be polymerized and to have a second portion of the resist blend to be unpolymerized, wherein the second portion is removable.
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4.发明申请公开(公告)号：US20180155472A1
公开(公告)日：2018-06-07
申请号：US15367069
申请日：2016-12-01
IPC分类号： C08F122/10 , C07C51/60 , C07C231/02 , C07C231/12 , B33Y70/00 , B33Y10/00 , B33Y80/00 , C09D4/00
摘要： According to one embodiment, a method includes contacting a triiodobenzoic acid with an oxalyl chloride in a solvent whereby triiodobenzoyl chloride is formed, contacting diethanolamine with triiodobenzoyl chloride where triiodobenzoic diol amine is formed, and forming an acrylate of triiodobenzoic diol amine with acryloyl chloride where an organoiodine compound is formed. According to another embodiment, an optically clear photopolymer resist blend for additive manufacturing includes a radiopaque pre-polymer compound where the compound includes at least one of the following: iodine, bromine, tin, lead, or bismuth. The resist blend also includes a photoinitiator, a polymerization inhibitor, and a base pre-polymer.
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