公开(公告)号：US07866376B2

公开(公告)日：2011-01-11

申请号：US11926701

申请日：2007-10-29

申请人： Lei Jiang ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Lei Jiang ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： F28D15/0233 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.

摘要翻译： 散热装置包括用于接触电子设备的基座，与基座热接触的翅片组，第一热管和连接基座和翅片组的第二热管。 翅片组具有比基部大的底部和与其底部分离的上部。 第一热管具有与翅片组的底部热接触的平坦顶面，包括与基部热接合的第一传递部分和从第一传递部分延伸并突出超出基部的第二传递部分。 第二热管包括与基座热接合的蒸发部分和从蒸发部分延伸并与翅片组的上部接合的冷凝部分。

公开(公告)号：US07537046B2

公开(公告)日：2009-05-26

申请号：US11695462

申请日：2007-04-02

申请人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Lei Cao ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base (10) for thermally engaging with an electronic device and a plurality of fins (320) arranged on the base (10). A heat pipe (52) thermally connects the fins (320) and the base (10) for transferring heat from the base (10) to the fins (320). The heat pipe (52) comprises an evaporation section (521) sandwiched between the base (10) and the fins (320), two condensation sections (525, 526) parallel to the evaporation section (521) and thermally engaging with the fins (320), and two connecting sections (527, 528) interconnecting corresponding condensation sections (525, 526) and the evaporation section (521). The connecting sections (527, 528) form an included angle therebetween. The condensation sections (525, 526) are spaced from and extend toward each other.

摘要翻译： 散热装置包括用于与电子设备热接合的基座（10）和布置在基座（10）上的多个翅片（320）。 热管（52）热连接翅片（320）和底座（10），用于将热量从基座（10）传送到散热片（320）。 热管（52）包括夹在基座（10）和翅片（320）之间的蒸发部分（521），与蒸发部分（521）平行的两个冷凝部分（525,526），并与翅片 320）和互连相应的冷凝部分（525,526）和蒸发部分（521）的两个连接部分（527,528）。 连接部分（527,528）在它们之间形成夹角。 冷凝部分（525,526）彼此间隔开并且彼此延伸。

公开(公告)号：US07643300B1

公开(公告)日：2010-01-05

申请号：US12336482

申请日：2008-12-16

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device used for removing heat from a plurality of memory module cards, includes a first bracket, a second bracket placed on the first bracket and a fin set arranged on the second bracket. The first bracket has a plurality of first sheets extending downwardly from a bottom thereof and defines a plurality of slots therein. The second bracket has a plurality of second sheets extending downwardly from a bottom thereof. The first sheets are respectively attached to sides of the memory module cards. The second sheets are respectively extended through the slots of the first bracket and attached to opposite sides of the memory module cards and opposite to the first sheets.

摘要翻译： 用于从多个存储模块卡移除热量的散热装置包括第一支架，设置在第一支架上的第二支架和布置在第二支架上的散热片组。 第一支架具有从底部向下延伸并在其中限定多个槽的多个第一片。 第二支架具有从底部向下延伸的多个第二片。 第一张纸分别安装在存储模块卡的两侧。 第二片分别延伸穿过第一托架的狭槽并且附接到存储模块卡的相对侧并与第一片相对。

公开(公告)号：US07345879B2

公开(公告)日：2008-03-18

申请号：US11308847

申请日：2006-05-15

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

摘要翻译： 散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。 主散热器包括设置在基座中间的基座（12）和散热部分（14）。 二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。 底座被放置在基板上，翅片组件布置在散热部分周围。 主散热器部分地叠置在具有紧凑结构的二次散热器上。 散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。

公开(公告)号：US08096136B2

公开(公告)日：2012-01-17

申请号：US12202404

申请日：2008-09-01

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： F25B21/02 ,  H05K7/20

CPC分类号： H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan.

摘要翻译： 散热装置包括基座，安装在基座顶部的翅片组，安装在翼片组顶部的风扇，安装在风扇上的中空风扇导管和固定在风扇导管上的热电冷却器。 热电冷却器包括具有珀尔帖效应并延伸通过风扇管道的侧壁的冷却模块和由风扇管道封闭并与冷却模块热接触的散热器。 冷却模块具有位于风扇管道内侧的冷表面，并且散热器与冷却模块的冷表面热接触。 风扇产生的气流首先流过散热器，然后通过风扇到达散热片组。

公开(公告)号：US20090316358A1

公开(公告)日：2009-12-24

申请号：US12399027

申请日：2009-03-06

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

摘要翻译： 散热装置包括具有限定多个通道之间的多个翅片的散热器。 通道在散热器的前侧和后侧具有入口和出口。 两个调节构件安装在散热器的两个侧面。 风扇位于散热器通道的入口处，用于向散热器提供气流。 引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。 引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

公开(公告)号：US20070000646A1

公开(公告)日：2007-01-04

申请号：US11164592

申请日：2005-11-30

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.

摘要翻译： 散热装置用于与发热电子装置接触以从电子装置移除热量。 散热装置包括基座，布置在基座上的多个翅片和至少一个热定位在基座上的热管。 热管包括U形第一部分，第二部分和互连第一和第二部分的连接部分。 热管的第一部分热接合基座。 热管的第二部分位于基座的上方，并与多个翅片热接合。

公开(公告)号：US07969728B2

公开(公告)日：2011-06-28

申请号：US12399027

申请日：2009-03-06

申请人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

摘要翻译： 散热装置包括具有限定多个通道之间的多个翅片的散热器。 通道在散热器的前侧和后侧具有入口和出口。 两个调节构件安装在散热器的两个侧面。 风扇位于散热器通道的入口处，用于向散热器提供气流。 引导构件定位在散热器的通道的出口处，用于将气流引导到散热装置周围的电子部件。 引导构件与调节构件接合并且可相对于调节构件垂直移动，从而沿着散热器的高度调节引导构件的高度。

公开(公告)号：US07746640B2

公开(公告)日：2010-06-29

申请号：US11777034

申请日：2007-07-12

申请人： Lei Cao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

发明人： Lei Cao ,  Dong-Bo Zheng ,  Meng Fu ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.

摘要翻译： 散热装置包括用于接触电子设备的基座，位于基座上的翅片组和第一热接合在基座中的第二热管。 第一热管包括第一传送部分和从第一传送部分的两个相对的自由端延伸的两个第二传送部分。 第二热管具有第一和第二传送部。 第二热管的第一传送部分位于第一热管的第一传送部分附近并且位于第一传送部分和第一热管的第二传​​送部分之一之间，第二传热部分的第二传热部分 管相邻于第一热管的第二转移部分之一。

公开(公告)号：US20070263358A1

公开(公告)日：2007-11-15

申请号：US11308847

申请日：2006-05-15

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Meng Fu ,  Dong-Bo Zheng

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： H01L23/467 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.

摘要翻译： 散热装置包括与中央处理单元接触的主散热器（10）和附接在与中央处理单元相邻的发热电子元件上的二次散热器（20）。 主散热器包括设置在基座中间的基座（12）和散热部分（14）。 二次散热器包括基板（22）和布置在基板上的多个翅片组件（24）。 底座被放置在基板上，翅片组件布置在散热部分周围。 主散热器部分地叠置在具有紧凑结构的二次散热器上。 散热部分可以同时从中央处理单元及其相邻的发热电子元件散热。