Gold conductor compositions
    1.
    发明授权
    Gold conductor compositions 失效
    金导体组成

    公开(公告)号:US3970590A

    公开(公告)日:1976-07-20

    申请号:US588131

    申请日:1975-06-23

    摘要: This invention relates to dispersions of gold and a certain inorganic binder in an inert liquid vehicle, useful in the electronics art for producing conductor patterns adherent to substrates. Small amounts of the binder are effective in producing excellent adhesion to substrates, such as ceramic substrates. The binders comprise certain amounts of the crystalline materials, PbF.sub.2, Cu.sub.2 O, and CdO, in addition to a glass of, by weight, 45-52% PbO, 3-6% B.sub.2 O.sub.3, 30-35% SiO.sub.2, 4-6% TiO.sub.2, 2-4% ZrO.sub.2, 0-1% ZnO, 1-4% Na.sub.2 O, 0-4% CdO, and 0-2% Li.sub.2 O.

    摘要翻译: 本发明涉及金和某种无机粘合剂在惰性液体载体中的分散体,其可用于电子学领域中用于制备粘附于基底的导体图案。 少量的粘合剂对于诸如陶瓷基材的基底具有优异的附着力是有效的。 粘合剂除了一种重量比为45-52%的PbO,3-6%B2O3,30-35%SiO 2,4-6%TiO 2的玻璃之外,还含有一定量的结晶材料PbF 2,Cu 2 O和CdO ,2-4%ZrO 2,0-1%ZnO,1-4%Na 2 O,0-4%CdO和0-2%Li 2 O。

    Gold conductor compositions
    2.
    发明授权
    Gold conductor compositions 失效
    金导体组成

    公开(公告)号:US4004057A

    公开(公告)日:1977-01-18

    申请号:US666496

    申请日:1976-03-12

    摘要: This invention relates to dispersions of gold and a certain inorganic binder in an inert liquid vehicle, useful in the electronics art for producing conductor patterns adherent to substrates. Small amounts of the binder are effective in producing excellent adhesion to substrates, such as ceramic substrates. The binders comprise certain amounts of the crystalline materials PbF.sub.2, Cu.sub.2 O, and CdO, in addition to a glass of, by weight, 45-52% PbO, 3-6% B.sub.2 O.sub.3, 30-35% SiO.sub.2, 4-6% TiO.sub.2, 2-4% ZrO.sub.2, 0-1% ZnO, 1-4% Na.sub.2 O, 0-4% CdO, and 0-2% Li.sub.2 O.

    摘要翻译: 本发明涉及金和某种无机粘合剂在惰性液体载体中的分散体,其可用于电子学领域中用于制备粘附于基底的导体图案。 少量的粘合剂对于诸如陶瓷基材的基底具有优异的附着力是有效的。 粘合剂除了一种重量比为45-52%的PbO,3-6%B2O3,30-35%的SiO2,4-6%TiO2的玻璃以外,还含有一定量的结晶材料PbF 2,Cu 2 O和CdO, 2-4%ZrO 2,0-1%ZnO,1-4%Na 2 O,0-4%CdO和0-2%Li 2 O。