公开(公告)号：US20150091034A1

公开(公告)日：2015-04-02

申请号：US14336055

申请日：2014-07-21

Applicant: Lextar Electronics Corporation

Inventor： Che-Ming HSU ,  Wen-Kai SHAO ,  Liang-Ta LIN

IPC: H01L33/50 ,  H01L33/56

CPC classification number: H01L33/504 ,  H01L33/60

Abstract: A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.

Abstract translation: 发光二极管（LED）封装结构包括引线框架，LED芯片，封装体，N不透明间隔物和N + 1封装胶水。 LED芯片设置在引线框架上; 封装主体覆盖引线框架并暴露LED芯片。 封装主体具有容纳空间，由配置在LED芯片上的N个不透明隔板分成N + 1个室。 将N + 1封装的胶水填充到N + 1室中，其中N是自然数。