公开(公告)号：US11422296B2

公开(公告)日：2022-08-23

申请号：US17134548

申请日：2020-12-28

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Lung-Kuan Lai ,  Shih-Yu Yeh ,  Guan-Zhi Chen ,  Hong-Zhi Liu ,  Kuo-Yen Chang ,  Ching-Hua Li

IPC: G02B6/00 ,  F21V8/00

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

公开(公告)号：US10720559B2

公开(公告)日：2020-07-21

申请号：US16153823

申请日：2018-10-07

Applicant: Lextar Electronics Corporation

Inventor： Lung-Kuan Lai ,  Pei-Song Cai ,  Jian-Chin Liang ,  Hao-Chung Chan ,  Hong-Zhi Liu

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56 ,  H01L25/075 ,  H01L33/48

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

公开(公告)号：US10908344B2

公开(公告)日：2021-02-02

申请号：US16373651

申请日：2019-04-03

Applicant: Lextar Electronics Corporation

Inventor： Pei-Song Cai ,  Lung-Kuan Lai ,  Shih-Yu Yeh ,  Guan-Zhi Chen ,  Hong-Zhi Liu ,  Kuo-Yen Chang ,  Ching-Hua Li

IPC: G02B6/00 ,  F21V8/00

Abstract: A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.